Samsung electronics co., ltd. (20240250072). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Youngdeuk Kim of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240250072 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the abstract consists of a first semiconductor chip with front and rear surfaces, rear protective layer, rear through-vias, front through-vias, and rear pads. A second semiconductor chip is stacked on top, connected to the rear pads through bump structures.
- The first semiconductor chip has rear through-vias with a greater width than the front through-vias.
- The second semiconductor chip is electrically connected to the first chip through the rear pads and bump structures.
- The package design allows for efficient electrical connections between the two chips.
Potential Applications: - This technology can be used in various electronic devices requiring stacked semiconductor chips. - It can be applied in high-performance computing systems, mobile devices, and IoT devices.
Problems Solved: - Enables compact and efficient stacking of semiconductor chips. - Facilitates reliable electrical connections between stacked chips.
Benefits: - Improved performance and functionality of electronic devices. - Enhanced reliability and durability of semiconductor packages.
Commercial Applications: Title: Advanced Semiconductor Package for Enhanced Device Performance This technology can be utilized in the production of smartphones, tablets, laptops, and other consumer electronics. It can also benefit the automotive industry for advanced driver-assistance systems and infotainment systems.
Prior Art: Researchers can explore prior patents related to semiconductor packaging, through-vias, and chip stacking technologies to understand the evolution of this field.
Frequently Updated Research: Researchers in the semiconductor industry continuously work on enhancing chip stacking techniques, improving electrical connections, and optimizing package designs for better performance.
Questions about Semiconductor Package Technology: 1. How does the width difference between rear and front through-vias impact the performance of the semiconductor package?
- The width difference allows for better heat dissipation and electrical conductivity between the stacked chips.
2. What are the key challenges in implementing this advanced semiconductor packaging technology in mass production?
- The main challenges include ensuring uniformity in through-vias fabrication, precise alignment of stacked chips, and maintaining reliability in high-volume manufacturing processes.
Original Abstract Submitted
a semiconductor package includes a first semiconductor chip including a substrate having a front surface and an opposite rear surface, a rear protective layer on the rear surface, a plurality of first and second rear through-vias penetrating through the rear protective layer and extending into the substrate, a plurality of front through-vias extending from the front surface and connected to the first rear through-vias, and a plurality of rear pads on the rear protective layer and connected to the plurality of first and second rear through-vias. a second semiconductor chip is on the first semiconductor chip, and includes a plurality of front pads electrically connected to the plurality of rear pads by respective bump structures. each of the plurality of rear through-vias has a width greater than a width of each of the plurality of front through-vias.
