Samsung electronics co., ltd. (20240250008). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SUNG KEUN Park of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240250008 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the abstract includes a redistribution substrate with an insulating layer and a first redistribution pattern, along with a semiconductor chip that is electrically connected to the redistribution substrate. The first redistribution pattern consists of a first barrier layer, a second barrier layer on top of the first barrier layer, and a via structure on the second barrier layer. The first barrier layer is made of a first conductive material, while the second barrier layer is made of a second conductive material different from the first.
- The semiconductor package includes a redistribution substrate with an insulating layer and a first redistribution pattern.
- A semiconductor chip is electrically connected to the redistribution substrate.
- The first redistribution pattern consists of a first barrier layer, a second barrier layer, and a via structure.
- The first barrier layer is made of a first conductive material, and the second barrier layer is made of a different second conductive material.
Potential Applications: - This technology can be used in various semiconductor devices and electronic components. - It can improve the performance and reliability of integrated circuits.
Problems Solved: - Enhances electrical connectivity and signal transmission within semiconductor packages. - Provides better protection against electrical interference and damage.
Benefits: - Improved electrical performance and reliability. - Enhanced protection against electrical issues. - Potential for smaller and more efficient semiconductor devices.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Performance This technology can be utilized in the manufacturing of advanced electronic devices, such as smartphones, computers, and IoT devices. It can also benefit industries like telecommunications, automotive, and aerospace.
Questions about Semiconductor Packaging Technology: 1. How does the use of different conductive materials in the barrier layers improve the performance of the semiconductor package? - The use of different conductive materials helps optimize the electrical properties and reliability of the package, enhancing its overall performance.
2. What are the key factors to consider when designing a semiconductor package with advanced redistribution patterns? - Design considerations include material selection, layer thickness, and via structure optimization to ensure optimal electrical connectivity and signal transmission.
Original Abstract Submitted
a semiconductor package, comprising a redistribution substrate including an insulating layer and a first redistribution pattern; and a semiconductor chip electrically connected to the redistribution substrate, wherein the first redistribution pattern comprises a first barrier layer; a second barrier layer on the first barrier layer; and a via structure on the second barrier layer, wherein the first barrier layer comprises a first conductive material and the second barrier layer comprises a second conductive material different from the first conductive material.
