Samsung electronics co., ltd. (20240243090). SEMICONDUCTOR PACKAGE INCLUDING POST simplified abstract
Contents
SEMICONDUCTOR PACKAGE INCLUDING POST
Organization Name
Inventor(s)
Hyungsun Jang of Hwaseong-si (KR)
Gayoung Kim of Hwaseong-si (KR)
Minjeong Shin of Suwon-si (KR)
SEMICONDUCTOR PACKAGE INCLUDING POST - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240243090 titled 'SEMICONDUCTOR PACKAGE INCLUDING POST
The semiconductor package described in the patent application includes a lower redistribution layer on the lower surface of the semiconductor chip, with various components such as an insulating layer, redistribution pattern, via, under bump metal (ubm), and a post.
- The post vertically overlaps with the ubm, and a mold layer surrounds the semiconductor chip.
- A connecting terminal is linked to the ubm, which consists of a first section contacting the redistribution pattern and a second section contacting the insulating layer.
- The post has a ring shape with inner and outer surfaces, where the maximum width of the inner surface is less than the maximum width of the upper surface of the first section of the ubm.
- The maximum width of the outer surface of the post is greater than the maximum width of the upper surface of the first section of the ubm.
Potential Applications: - This technology can be applied in various semiconductor packaging processes to enhance performance and reliability. - It can be utilized in the manufacturing of advanced electronic devices such as smartphones, tablets, and computers.
Problems Solved: - The semiconductor package addresses issues related to signal transmission, heat dissipation, and electrical connectivity in semiconductor devices. - It improves the overall functionality and durability of electronic products.
Benefits: - Enhanced signal integrity and electrical performance. - Improved thermal management and reliability. - Compact design for smaller form factor devices.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Performance This technology can be commercially used in the production of high-performance electronic devices, leading to improved product quality and customer satisfaction. The market implications include increased demand for advanced semiconductor packaging solutions in the electronics industry.
Questions about Semiconductor Packaging Technology: 1. How does this semiconductor packaging technology improve signal transmission and electrical connectivity? 2. What are the potential commercial applications of this advanced packaging technology?
Frequently Updated Research: Researchers are continuously exploring new materials and manufacturing techniques to further enhance the performance and reliability of semiconductor packaging technologies. Stay updated on the latest advancements in the field to leverage the benefits of this innovative technology.
Original Abstract Submitted
a semiconductor package includes a lower redistribution layer disposed on a lower surface of the semiconductor chip including an insulating layer, a redistribution pattern, a via, an under bump metal (ubm), and a post disposed on the redistribution pattern. the post vertically overlaps with the ubm. a mold layer is on the lower redistribution layer and surrounds the semiconductor chip. a connecting terminal is connected to the ubm. the ubm includes a first section contacting the redistribution pattern, and a second section contacting the insulating layer. the post has a ring shape having an inner surface and an outer surface when viewed in a top view. a maximum width of the inner surface is less than a maximum width of an upper surface of the first section. a maximum width of the outer surface is greater than the maximum width of the upper surface of the first section.
