Samsung electronics co., ltd. (20240241451). METHOD OF MEASURING OVERLAY AND SEMICONDUCTOR DEVICE MANUFACTURED USING THE SAME simplified abstract
Contents
METHOD OF MEASURING OVERLAY AND SEMICONDUCTOR DEVICE MANUFACTURED USING THE SAME
Organization Name
Inventor(s)
Byeong-Hwan Son of Suwon-si (KR)
METHOD OF MEASURING OVERLAY AND SEMICONDUCTOR DEVICE MANUFACTURED USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240241451 titled 'METHOD OF MEASURING OVERLAY AND SEMICONDUCTOR DEVICE MANUFACTURED USING THE SAME
The abstract describes a method of measuring overlay in semiconductor manufacturing processes. This involves forming an active region on a cell region of a substrate and at least one overlay key structure on a scribe lane region.
- Formation of mask patterns on the active region and overlay key structure
- Alignment checking using sub-patterns on the key structure
- Ion implantation processes based on alignment results
- Second sub-pattern wider than the first sub-pattern
- Potential Applications:**
- Semiconductor manufacturing - Quality control in chip production
- Problems Solved:**
- Ensuring accurate alignment in semiconductor processes - Improving overlay measurement accuracy
- Benefits:**
- Enhanced precision in semiconductor manufacturing - Reduced defects in chip production
- Commercial Applications:**
Title: Advanced Overlay Measurement Method for Semiconductor Manufacturing This technology can be used in semiconductor fabrication facilities to improve the accuracy of overlay measurements, leading to higher quality chips and increased efficiency in production processes.
- Prior Art:**
Researchers can explore existing patents and publications related to overlay measurement methods in semiconductor manufacturing to understand the evolution of this technology.
- Frequently Updated Research:**
Researchers and industry experts are constantly working on improving overlay measurement techniques to meet the demands of ever-shrinking semiconductor devices.
- Questions about Overlay Measurement:**
1. How does this method compare to traditional overlay measurement techniques?
- This method offers improved accuracy and precision compared to traditional techniques by utilizing sub-patterns on overlay key structures for alignment.
2. What are the potential challenges in implementing this advanced overlay measurement method in semiconductor manufacturing?
- Challenges may include optimizing the process for different types of substrates and ensuring consistency across production lines.
Original Abstract Submitted
a method of measuring overlay, including forming an active region on a cell region of a substrate and forming at least one overlay key structure on a scribe lane region of the substrate, forming a first mask pattern on the active region and forming a first sub-pattern on the overlay key structure, checking an alignment using the first sub-pattern, performing a first ion implantation process into the substrate, forming a second mask pattern on the active region and forming a second sub-pattern on the overlay key structure, checking the alignment using the second sub-pattern, and performing a second ion implantation process into the substrate, wherein a second width of the second sub-pattern is greater than a first width of the first sub-pattern.
