Samsung electronics co., ltd. (20240238939). SUBSTRATE POLISHING APPARATUS simplified abstract
SUBSTRATE POLISHING APPARATUS
Organization Name
Inventor(s)
Donghoon Kwon of Suwon-si (KR)
SUBSTRATE POLISHING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240238939 titled 'SUBSTRATE POLISHING APPARATUS
The abstract of this patent application describes a substrate polishing apparatus that includes a platen for polishing a semiconductor substrate, a slurry supply for providing slurry between the substrate and the platen, a substrate holder with a circular shape to hold the substrate in contact with the platen, a temperature controller to regulate the platen's temperature through direct contact thermal transfer, and a cleaning component to supply a cleaning solution to the substrate holder and temperature controller.
- The substrate polishing apparatus has a circular substrate holder for semiconductor substrates.
- A temperature controller with an arc-shaped thermal conductive body controls the platen's temperature through direct contact thermal transfer.
- The cleaning component supplies a cleaning solution to the substrate holder and temperature controller.
- The apparatus is designed to efficiently polish semiconductor substrates with precision and control over temperature and cleaning processes.
- The innovative design of the temperature controller enhances the polishing process by ensuring optimal temperature conditions for substrate polishing.
Potential Applications: This technology can be used in semiconductor manufacturing facilities for polishing substrates used in various electronic devices such as integrated circuits, microprocessors, and memory chips.
Problems Solved: The substrate polishing apparatus addresses the need for precise temperature control during the polishing process, as well as the requirement for effective cleaning solutions to maintain substrate quality.
Benefits: - Improved polishing efficiency and precision - Enhanced temperature control for better substrate quality - Effective cleaning solutions for maintaining substrate cleanliness
Commercial Applications: The substrate polishing apparatus can be utilized in semiconductor fabrication plants, electronics manufacturing companies, and research institutions for semiconductor substrate polishing processes.
Questions about the Technology: 1. How does the circular shape of the substrate holder contribute to the polishing process? 2. What are the advantages of using a temperature controller with an arc-shaped thermal conductive body for substrate polishing?
Original Abstract Submitted
a substrate polishing apparatus includes a platen having an upper surface configured to polish a semiconductor substrate, a slurry supply configured to supply slurry between the semiconductor substrate and the platen, a substrate holder configured to hold the semiconductor substrate and to bring the semiconductor substrate in contact with the upper surface of the platen, the substrate holder having a circular shape, a temperature controller configured to control temperature of the platen through thermal transfer via direct contact, wherein the temperature controller has a thermal conductive body that has an arc shape and the thermal conductive body is spaced apart from the substrate holder and surrounds at least a portion of the substrate holder, and a cleaning component configured to supply a cleaning solution to the substrate holder and the temperature controller.