Samsung electronics co., ltd. (20240234384). METHOD AND DEVICE FOR TRANSFERRING ELECTRONIC CHIP simplified abstract
Contents
METHOD AND DEVICE FOR TRANSFERRING ELECTRONIC CHIP
Organization Name
Inventor(s)
Kyungwook Hwang of Suwon-si (KR)
Joonyong Park of Suwon-si (KR)
Sanghoon Song of Suwon-si (KR)
METHOD AND DEVICE FOR TRANSFERRING ELECTRONIC CHIP - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240234384 titled 'METHOD AND DEVICE FOR TRANSFERRING ELECTRONIC CHIP
The method described in the abstract involves transferring electronic chips from a base substrate to a target substrate using a relay substrate and a solvent.
- Electronic chips are attached to a relay substrate.
- The chips are separated from the base substrate.
- A target substrate is wetted with a solvent.
- The chips are transferred to the target substrate.
- The relay substrate is pressed in the thickness direction of the target substrate.
- The target substrate is dried.
Potential Applications: - Semiconductor manufacturing - Electronics assembly - Microchip production
Problems Solved: - Efficient transfer of electronic chips - Minimizing damage during transfer process
Benefits: - Improved accuracy in chip placement - Cost-effective manufacturing process - Enhanced productivity in electronics industry
Commercial Applications: Title: Advanced Electronic Chip Transfer Technology for Semiconductor Industry This technology can be used in semiconductor manufacturing plants to streamline the process of transferring electronic chips, leading to increased efficiency and reduced production costs.
Questions about Electronic Chip Transfer Technology: 1. How does this method improve the accuracy of chip placement during transfer?
- This method ensures precise alignment of electronic chips on the target substrate, reducing errors in placement.
2. What are the advantages of using a relay substrate in the chip transfer process?
- The relay substrate acts as a bridge between the base substrate and the target substrate, facilitating the transfer of electronic chips with minimal damage.
Original Abstract Submitted
a method of transferring electronic chips includes attaching, to a relay substrate, the electronic chips arranged on a base substrate, separating the electronic chips from the base substrate, wetting a target substrate using a solvent, transferring, to the target substrate, the electronic chips that are attached to the relay substrate, pressing the relay substrate in a thickness direction of the target substrate, and drying the target substrate.
