Samsung electronics co., ltd. (20240234377). SEMICONDUCTOR PACKAGES simplified abstract
Contents
SEMICONDUCTOR PACKAGES
Organization Name
Inventor(s)
Kwangjin Moon of Suwon-si (KR)
SEMICONDUCTOR PACKAGES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240234377 titled 'SEMICONDUCTOR PACKAGES
The semiconductor package described in the patent application consists of a first structure with a semiconductor chip and a second structure on top of it. The second structure includes another semiconductor chip, a semiconductor pattern, an insulating pattern, and through-electrode structures.
- The first structure contains a semiconductor chip with an integrated circuit.
- The second structure includes a second semiconductor chip with an integrated circuit.
- A semiconductor pattern is located horizontally spaced apart from the second semiconductor chip.
- An insulating pattern separates the second semiconductor chip from the semiconductor pattern.
- Through-electrode structures penetrate through either the second semiconductor chip or the semiconductor pattern.
- The semiconductor pattern has two side surfaces, one facing the second semiconductor chip and the other opposing it.
- The second side surface of the semiconductor pattern aligns vertically with a side surface of the first semiconductor chip.
Potential Applications: - This technology could be used in advanced semiconductor packaging for electronic devices. - It may find applications in high-performance computing systems and telecommunications equipment.
Problems Solved: - Enhances the integration of multiple semiconductor chips in a compact package. - Improves the efficiency and performance of semiconductor devices.
Benefits: - Increased functionality and processing power in a smaller form factor. - Enhanced reliability and durability of semiconductor packages.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Performance This technology can be utilized in the development of cutting-edge electronic devices, leading to improved performance and efficiency. It has the potential to revolutionize the semiconductor packaging industry by enabling the creation of more powerful and compact devices for various commercial applications.
Questions about the technology: 1. How does the through-electrode structure contribute to the overall functionality of the semiconductor package? 2. What are the potential challenges in implementing this advanced semiconductor packaging technology in mass production?
Original Abstract Submitted
a semiconductor package includes a first structure including a first semiconductor chip comprising a first semiconductor integrated circuit, and a second structure on the first structure. the second structure includes a second semiconductor chip including a second semiconductor integrated circuit, a semiconductor pattern horizontally spaced apart from the second semiconductor chip and on a side surface of the second semiconductor chip, an insulating pattern between the second semiconductor chip and the semiconductor pattern, and through-electrode structures. at least one of the through-electrode structures penetrates through at least a portion of the second semiconductor chip or penetrates through the semiconductor pattern. the semiconductor pattern has a first side surface facing the side surface of the second semiconductor chip and a second side surface opposing the first side surface. the second side surface of the semiconductor pattern is vertically aligned with a side surface of the first semiconductor chip.
