Samsung electronics co., ltd. (20240234362). SEMICONDUCTOR MANUFACTURING EQUIPMENT simplified abstract
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SEMICONDUCTOR MANUFACTURING EQUIPMENT
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SEMICONDUCTOR MANUFACTURING EQUIPMENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240234362 titled 'SEMICONDUCTOR MANUFACTURING EQUIPMENT
The abstract describes a semiconductor manufacturing equipment with a bonding head, a head heater with a thermal compression surface, negative pressure channels, and a bonding tool for thermal compression of a semiconductor chip.
- The equipment includes a bonding head with a head heater at the bottom, featuring a thermal compression surface.
- Negative pressure channels are recessed from the thermal compression surface, with holes for functionality.
- A bonding tool is provided with grooves on the first surface to contact the thermal compression surface.
- The second surface of the bonding tool contacts the semiconductor chip for thermal compression.
Potential Applications: - Semiconductor manufacturing processes - Assembly of semiconductor chips - Thermal compression bonding in electronic devices
Problems Solved: - Efficient thermal compression bonding - Precise contact between bonding tool and semiconductor chip - Enhanced semiconductor manufacturing processes
Benefits: - Improved bonding quality - Increased productivity in semiconductor manufacturing - Enhanced reliability of electronic devices
Commercial Applications: Title: Semiconductor Manufacturing Equipment for Enhanced Bonding This technology can be utilized in the semiconductor industry for efficient and reliable bonding processes, leading to improved product quality and performance. The market implications include faster production cycles and higher yields for semiconductor manufacturers.
Questions about Semiconductor Manufacturing Equipment for Enhanced Bonding: 1. How does the negative pressure channels contribute to the bonding process?
- The negative pressure channels help in ensuring proper alignment and contact between the bonding tool and the semiconductor chip, enhancing the quality of the bonding process.
2. What are the advantages of using a head heater with a thermal compression surface in semiconductor manufacturing?
- The head heater with a thermal compression surface allows for precise and controlled thermal compression bonding, resulting in high-quality semiconductor devices.
Original Abstract Submitted
semiconductor manufacturing equipment including a main body having a bonding head, a head heater at a bottom of the bonding head, the head heater including a thermal compression surface, negative pressure channels recessed from the thermal compression surface and the negative pressure channels including holes therein, and a bonding tool having a first surface, a second surface, grooves at the first surface, the first surface configured to contact the thermal compression surface, and the second surface opposite to the first surface contacting a semiconductor chip for thermal compression may be provided.
