Samsung electronics co., ltd. (20240234342). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240234342 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application consists of a semiconductor chip with a substrate having two surfaces, a chip pad with a conductive layer, a support pad with an insulating layer, a support bump connected to the support pad, a wiring substrate facing the semiconductor substrate, a support bonding on trace (bot) pad on the wiring substrate bonded to the support bump, and a dummy area on the wiring substrate away from the support bot pad.
- The semiconductor package includes a unique support structure with a support pad and support bump for enhanced stability.
- The presence of a dummy area on the wiring substrate helps in optimizing the layout and design of the package.
- The support bonding on trace (bot) pad ensures secure bonding between the wiring substrate and the support bump.
- The combination of the chip pad, support pad, and support bump provides a reliable and efficient packaging solution for the semiconductor chip.
- The insulating layer on the support pad helps in preventing electrical interference and ensures proper functioning of the semiconductor package.
Potential Applications: - This technology can be applied in various electronic devices requiring semiconductor packaging. - It can be used in consumer electronics, automotive electronics, and industrial applications.
Problems Solved: - Provides a stable and reliable packaging solution for semiconductor chips. - Helps in optimizing the layout and design of semiconductor packages. - Prevents electrical interference and ensures proper functioning of electronic devices.
Benefits: - Enhanced stability and reliability of semiconductor packages. - Improved performance and efficiency of electronic devices. - Optimal layout and design for semiconductor packaging.
Commercial Applications: - The technology can be utilized by semiconductor manufacturers for packaging their chips. - It can be integrated into various electronic devices to improve their performance and reliability.
Questions about Semiconductor Package Technology: 1. How does the support bump contribute to the stability of the semiconductor package? 2. What are the advantages of having a dummy area on the wiring substrate in semiconductor packaging?
Frequently Updated Research: - Stay updated on the latest advancements in semiconductor packaging technology to ensure optimal performance and reliability in electronic devices.
Original Abstract Submitted
a semiconductor package includes a semiconductor chip including a semiconductor substrate having a first surface and a second surface opposite to the first surface, a chip pad located on the first surface and including a conductive layer, a support pad positioned on the first surface, spaced apart from the chip pad and including an insulating layer, a support bump connected to the support pad, a wiring substrate disposed to face the semiconductor substrate, a support bonding on trace (bot) pad disposed on the wiring substrate and bonded to the support bump, and a dummy area disposed on the wiring substrate and spaced apart from the support bot pad.
