Samsung electronics co., ltd. (20240234279). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Choongbin Yim of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240234279 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the abstract consists of multiple layers and bonding pads, with redistribution structures connecting them. A semiconductor chip is mounted on the redistribution structure, with another redistribution structure on top of it. A bonding wire connects the bonding pads of the two redistribution structures, and a molding layer covers the entire assembly.
- The semiconductor package includes multiple redistribution structures with bonding pads.
- A semiconductor chip is mounted on one redistribution structure, with another on top of it.
- A bonding wire connects the bonding pads of the two redistribution structures.
- A molding layer covers the entire assembly for protection.
- The design allows for efficient electrical connections within the package.
Potential Applications: This technology can be used in various electronic devices such as smartphones, tablets, and computers where compact and efficient semiconductor packaging is required.
Problems Solved: This technology addresses the need for compact and efficient semiconductor packaging solutions that provide reliable electrical connections.
Benefits: The semiconductor package offers improved electrical connectivity, compact design, and protection for the semiconductor chip.
Commercial Applications: This technology can be applied in the consumer electronics industry for the production of compact and reliable electronic devices.
Prior Art: Researchers can explore prior art related to semiconductor packaging, redistribution structures, and bonding wire connections in the field of electronics manufacturing.
Frequently Updated Research: Researchers can stay updated on advancements in semiconductor packaging, redistribution structures, and bonding wire technologies for improved electronic device manufacturing.
Questions about Semiconductor Packaging: 1. How does the bonding wire contribute to the electrical connectivity within the semiconductor package? 2. What are the potential challenges in scaling up this semiconductor packaging technology for mass production?
Original Abstract Submitted
a semiconductor package includes a first redistribution structure including a first redistribution layer and a first redistribution bonding pad, the first redistribution bonding pad electrically connected to the first redistribution layer, a first semiconductor chip on the first redistribution structure, and a second redistribution structure on the first semiconductor chip, the second redistribution structure including a second redistribution layer and a second redistribution bonding pad, the second redistribution layer electrically connected to the second redistribution layer. the semiconductor package includes a bonding wire electrically connecting the second redistribution bonding pad and the first redistribution bonding pad to each other, and a molding layer covering at least a portion the first semiconductor chip, the second redistribution structure, and the bonding wire on the first redistribution structure.
