Samsung electronics co., ltd. (20240234277). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240234277 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application consists of a base film with peripheral regions and an inner region, a unit film package on the inner region defined by a cut line, dummy patterns on the peripheral regions, and a first solder resist layer covering the unit film package inside the cut line.
- The semiconductor package includes a base film with peripheral regions and an inner region.
- A unit film package is disposed on the inner region and defined by a cut line.
- Dummy patterns are placed on the peripheral regions and between the cut line and the opposite ends in the width direction.
- A first solder resist layer covers the unit film package inside the cut line and extends in the width direction, running across the cut line and covering the dummy patterns.
Potential Applications: - This technology can be used in the manufacturing of semiconductor devices for various electronic applications. - It can improve the reliability and performance of semiconductor packages in different electronic devices.
Problems Solved: - Enhances the structural integrity and reliability of semiconductor packages. - Provides better protection for the unit film package within the base film.
Benefits: - Improved durability and longevity of semiconductor packages. - Enhanced performance and reliability of electronic devices utilizing these packages.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Device Performance This technology can be applied in the production of smartphones, tablets, laptops, and other electronic devices requiring high-performance semiconductor packages. It can also benefit the automotive industry for advanced electronic systems in vehicles.
Questions about Semiconductor Packaging Technology: 1. How does this innovation impact the overall efficiency of electronic devices? This technology enhances the reliability and performance of semiconductor packages, leading to improved efficiency in electronic devices.
2. What are the potential cost savings associated with implementing this semiconductor packaging technology? By improving the durability and reliability of semiconductor packages, this technology can reduce maintenance and replacement costs for electronic devices over time.
Original Abstract Submitted
a semiconductor package includes a base film that has peripheral regions extending in a longitudinal direction and an inner region disposed between the peripheral regions and extending in the longitudinal direction. a unit film package is disposed on the inner region of the base film and is defined by a cut line. dummy patterns are disposed on the peripheral regions of the base film and between the cut line and the opposite ends in the width direction. a first solder resist layer is disposed on the base film and covers the unit film package inside the cut line. in a plan view, the first solder resist layer extends in the width direction, runs across the cut line, and covers the dummy patterns.
