Samsung electronics co., ltd. (20240234219). METHOD OF TRANSFERRING MICRO SEMICONDUCTOR CHIP AND TRANSFERRING STRUCTURE simplified abstract

METHOD OF TRANSFERRING MICRO SEMICONDUCTOR CHIP AND TRANSFERRING STRUCTURE

Organization Name

samsung electronics co., ltd.

Inventor(s)

Youngtek Oh of Suwon-si (KR)

Joonyong Park of Suwon-si (KR)

Kyungwook Hwang of Suwon-si (KR)

Dongkyun Kim of Suwon-si (KR)

Dongho Kim of Suwon-si (KR)

Sanghoon Song of Suwon-si (KR)

Minchul Yu of Suwon-si (KR)

Junsik Hwang of sUWON-SI (KR)

METHOD OF TRANSFERRING MICRO SEMICONDUCTOR CHIP AND TRANSFERRING STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240234219 titled 'METHOD OF TRANSFERRING MICRO SEMICONDUCTOR CHIP AND TRANSFERRING STRUCTURE

Simplified Explanation: The patent application describes a method for transferring micro semiconductor chips using a transferring structure. This involves aligning base transferring substrates on two different substrates and transferring the chips to these substrates.

• The method involves using base transferring substrates with grooves to facilitate the transfer of micro semiconductor chips.
• The transferring structure includes a target transferring structure and a preliminary transferring structure for efficient chip transfer.
• The process allows for the organized transfer of micro semiconductor chips onto different substrates.

Key Features and Innovation:

• Utilization of base transferring substrates with grooves for efficient chip transfer.
• Introduction of a target transferring structure and a preliminary transferring structure for organized chip transfer.
• Alignment of base transferring substrates on different substrates to facilitate chip transfer.

Potential Applications: The technology can be applied in semiconductor manufacturing processes for efficient chip transfer and organization.

Problems Solved: The method addresses the challenge of transferring micro semiconductor chips in a structured and organized manner.

Benefits:

• Improved efficiency in transferring micro semiconductor chips.
• Enhanced organization of chips on different substrates.

Commercial Applications: The technology can be utilized in semiconductor manufacturing industries to streamline chip transfer processes, potentially leading to cost savings and improved productivity.

Prior Art: Readers can explore prior research on semiconductor chip transfer methods in semiconductor manufacturing processes.

Frequently Updated Research: Stay updated on the latest advancements in semiconductor chip transfer technologies for potential improvements in efficiency and organization.

Questions about Semiconductor Chip Transfer: 1. How does the method of aligning base transferring substrates contribute to the efficiency of chip transfer? 2. What are the potential implications of using a target transferring structure in semiconductor manufacturing processes?

Original Abstract Submitted

a method of transferring a micro semiconductor chip and a transferring structure are provided. the method includes providing a plurality of base transferring substrates each including a plurality of grooves, aligning the plurality of base transferring substrates on a first substrate, aligning the plurality of base transferring substrates on a second substrate, providing a target transferring structure by transferring micro semiconductor chips to the base transferring substrates of the first substrate, and providing a preliminary transferring structure by transferring micro semiconductor chips to the base transferring substrates of the second substrate.