Samsung electronics co., ltd. (20240234193). WAFER PROCESSING APPARATUS simplified abstract
Contents
WAFER PROCESSING APPARATUS
Organization Name
Inventor(s)
Youngho Hwang of Suwon-si (KR)
WAFER PROCESSING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240234193 titled 'WAFER PROCESSING APPARATUS
The wafer processing apparatus described in the abstract includes a plate with support pins for mounting a wafer and vacuum ports for fixing the wafer, a heater to heat the plate, a flow regulator to control the flow rate of a fluid into the vacuum ports, and a chuck controller to adjust the target flow rate of the fluid during the wafer heating process.
- Plate with support pins and vacuum ports for wafer mounting and fixing
- Heater to heat the plate
- Flow regulator to control fluid flow into vacuum ports
- Chuck controller to adjust fluid flow rate during wafer heating process
- Flow control signal generated to reduce fluid flow rate during heating process
Potential Applications: - Semiconductor wafer processing - Thin film deposition - Microelectronics manufacturing
Problems Solved: - Ensures proper fixation of wafer during heating process - Controls fluid flow rate for optimal processing conditions
Benefits: - Improved wafer processing efficiency - Enhanced control over heating process - Consistent and reliable results
Commercial Applications: Title: Advanced Wafer Processing Apparatus for Semiconductor Manufacturing This technology can be used in semiconductor fabrication facilities to enhance wafer processing efficiency and quality control. It can also be valuable in research and development labs focusing on microelectronics manufacturing.
Prior Art: Prior research in wafer processing technologies, vacuum chuck systems, and fluid flow control mechanisms can provide insights into the development of this innovative apparatus.
Frequently Updated Research: Researchers are constantly exploring new materials and methods for wafer processing to improve semiconductor device performance and production yields.
Questions about Wafer Processing Apparatus: 1. How does the flow regulator adjust the flow rate of the fluid during the wafer heating process? 2. What are the key advantages of using a chuck controller in controlling the fluid flow rate during wafer processing?
Original Abstract Submitted
provided is a wafer processing apparatus including a plate having a plurality of support pins configured such that a wafer is mounted on the plurality of support pins and a plurality of vacuum ports positioned between the plurality of support pins, a heater configured to heat the plate, a flow regulator configured to provide a vacuum pressure for fixing the wafer to the plurality of vacuum ports, and configured to adjust a flow rate of a fluid flowing into the plurality of vacuum ports to be a target flow rate, and a chuck controller configured to control the target flow of the fluid set in the flow regulator, wherein the chuck controller is configured to generate a flow control signal for reducing the target flow rate of the fluid and send the flow control signal to the flow regulator during a heating process of the wafer.
