Samsung electronics co., ltd. (20240234177). WAFER PROCESSING APPARATUS simplified abstract
Contents
WAFER PROCESSING APPARATUS
Organization Name
Inventor(s)
Hun Yong Park of Suwon-si (KR)
Tae Soon Park of Suwon-si (KR)
Jung Chul Lee of Suwon-si (KR)
WAFER PROCESSING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240234177 titled 'WAFER PROCESSING APPARATUS
The abstract describes a wafer processing apparatus with a chamber that has a first rib on the outer side of a sidewall. The first rib has different light transmittance properties in its first and second portions.
- Simplified Explanation:
- Wafer processing apparatus with a chamber and a rib on the outer side of a sidewall with varying light transmittance.
- Key Features and Innovation:
- Chamber providing internal space for wafer processing. - First rib on the outer side of a sidewall with different light transmittance in its portions.
- Potential Applications:
- Semiconductor manufacturing. - Thin film deposition processes. - Solar cell production.
- Problems Solved:
- Control of light transmittance in wafer processing. - Enhanced process efficiency.
- Benefits:
- Improved process control. - Higher quality output. - Potential cost savings.
- Commercial Applications:
- Semiconductor industry for wafer processing. - Thin film coating companies. - Solar panel manufacturers.
- Questions about Wafer Processing Apparatus:
1. How does the varying light transmittance in the rib benefit wafer processing? - The different light transmittance helps in controlling the exposure of the wafer to light during processing, leading to improved quality and efficiency.
2. What are the potential drawbacks of having a rib with varying light transmittance? - One potential drawback could be the complexity of manufacturing and maintaining such a structure, which may increase production costs.
Original Abstract Submitted
a wafer processing apparatus may include a chamber providing an internal space; and a first rib on an outer side of a first sidewall of the chamber. an outer side of the first rib may include a first portion and a second portion. a light transmittance of the first portion may be different from a light transmittance of the second portion.
- Samsung electronics co., ltd.
- Hun Yong Park of Suwon-si (KR)
- Yeon Tae Kim of Suwon-si (KR)
- Jang Hwi Lee of Suwon-si (KR)
- Sang Woo Bae of Suwon-si (KR)
- Kyung Su Kim of Suwon-si (KR)
- Tae Soon Park of Suwon-si (KR)
- Jung Chul Lee of Suwon-si (KR)
- Sung Ho Jang of Suwon-si (KR)
- Won Don Joo of Suwon-si (KR)
- H01L21/67
- C23C16/44
- C23C16/452
- H01L21/02
- CPC H01L21/67115