Samsung electronics co., ltd. (20240234093). SUBSTRATE PROCESSING APPARATUS simplified abstract
Contents
SUBSTRATE PROCESSING APPARATUS
Organization Name
Inventor(s)
Dougyong Sung of Suwon-si (KR)
SUBSTRATE PROCESSING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240234093 titled 'SUBSTRATE PROCESSING APPARATUS
The abstract describes a substrate processing apparatus that includes a chamber with upper and lower sections for generating different plasmas, a substrate support, distribution plates for injecting ions onto the substrate, plasma generating devices, and a controller for alternating their operation.
- The substrate processing apparatus has a unique design with separate upper and lower chambers for generating different plasmas.
- Distribution plates are strategically placed between the plasma regions to inject ions onto the substrate, enhancing the processing capabilities.
- The apparatus includes plasma generating devices that operate alternately under the control of a controller, allowing for precise control over the plasma processes.
- This innovative design enables efficient and effective processing of substrates, leading to improved outcomes in various applications.
- The apparatus can be used in industries such as semiconductor manufacturing, surface treatment, and thin film deposition, among others.
Potential Applications: - Semiconductor manufacturing - Surface treatment processes - Thin film deposition
Problems Solved: - Enhanced control over plasma processes - Improved substrate processing efficiency - Precise injection of ions onto the substrate
Benefits: - Increased processing accuracy - Higher quality substrate treatments - Improved overall productivity
Commercial Applications: Title: Advanced Substrate Processing Apparatus for Semiconductor Manufacturing This technology can be utilized in semiconductor manufacturing facilities to enhance the efficiency and accuracy of substrate processing. The precise control over plasma processes and ion injection provided by this apparatus can lead to higher quality semiconductor products and improved manufacturing outcomes.
Questions about Substrate Processing Apparatus: 1. How does the design of the apparatus contribute to improved substrate processing efficiency? The separate upper and lower chambers for generating different plasmas allow for precise control over the plasma processes, leading to enhanced efficiency in substrate processing.
2. What industries can benefit from the use of this substrate processing apparatus? Various industries such as semiconductor manufacturing, surface treatment, and thin film deposition can benefit from the advanced capabilities of this apparatus.
Original Abstract Submitted
a substrate processing apparatus includes a chamber including an upper chamber defining a first plasma region for generating first plasma and a lower chamber defining a second plasma region for generating second plasma; a substrate support below the first and second plasma regions in the lower chamber, and configured to support a substrate; distribution plates between the first and second plasma regions in the upper chamber, and configured to inject ions included in the first plasma onto the substrate; a first plasma generating device on a side of the upper chamber and configured to generate the first plasma from a first process gas; a second plasma generating device on a side of the lower chamber and configured to generate the second plasma from a second process gas; and a controller that alternately operates the first plasma generating device and the second plasma generating device.
