Samsung electronics co., ltd. (20240224544). PROCESSOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract
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PROCESSOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
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PROCESSOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240224544 titled 'PROCESSOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
The abstract describes a processor chip for a semiconductor package with chip pads arranged in a specific manner on the substrate.
- Simplified Explanation: The processor chip has chip pads arranged on one side of the substrate in a specific pattern.
- Key Features and Innovation:
- Substrate with chip pads arranged on one side in a specific layout. - Division of the substrate into a first area with four sides and a second area at the center. - Chip pads located on the first area in a line along at least a portion of a side.
- Potential Applications:
- Semiconductor manufacturing - Electronics industry - Integrated circuit design
- Problems Solved:
- Efficient arrangement of chip pads on the substrate - Improved connectivity between chip pads and package substrate
- Benefits:
- Enhanced performance of the processor chip - Streamlined manufacturing process - Better reliability and connectivity
- Commercial Applications:
- Semiconductor packaging companies - Electronics manufacturers - Research and development in the semiconductor industry
- Questions about Processor Chip Technology:
1. How does the specific arrangement of chip pads on the substrate improve performance? - The specific arrangement of chip pads ensures efficient connectivity and signal transmission within the processor chip.
2. What are the potential challenges in implementing this technology in mass production? - Challenges may include ensuring precise alignment of chip pads during manufacturing processes and maintaining consistency in the arrangement across multiple chips.
Original Abstract Submitted
a processor chip for a semiconductor package includes a substrate having a first surface and a second surface opposite to the first surface and mounted on a package substrate, and a plurality of chip pads disposed on the first surface of the substrate and electrically connected to the package substrate, wherein the first surface is divided into a first area and a second area, the first area includes four sides of the first surface and the second area includes a center of the first surface, and the plurality of chip pads are located on the first area and are arranged on at least a portion of a side of the first surface in a line along the side.
