Samsung electronics co., ltd. (20240217014). SOLDER PRINTING APPARATUS simplified abstract
Contents
SOLDER PRINTING APPARATUS
Organization Name
Inventor(s)
Seongchan Han of Suwon-si (KR)
Sangmyung Lee of Suwon-si (KR)
SOLDER PRINTING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240217014 titled 'SOLDER PRINTING APPARATUS
Simplified Explanation: The patent application describes a solder printing apparatus that feeds printed circuit boards, prints solder paste on them, cleans residual solder, and adjusts printing parameters based on cleaning cycles.
- Sequential feeding of printed circuit boards
- Locating and printing solder paste through a solder mask
- Cleaning residual solder from the solder mask
- Setting printing parameters based on cleaning cycle count
- Control unit for managing printing and cleaning processes
Key Features and Innovation: - Sequential feeding of printed circuit boards - Precise printing of solder paste through solder masks - Cleaning residual solder efficiently - Adaptive printing parameters based on cleaning cycle count - Centralized control unit for managing the printing and cleaning units
Potential Applications: This technology can be used in electronics manufacturing industries for efficient and precise solder printing processes.
Problems Solved: - Ensures accurate solder paste printing on printed circuit boards - Improves the cleanliness of solder masks - Enhances the overall quality of soldering processes
Benefits: - Increased efficiency in solder printing operations - Improved quality control in electronics manufacturing - Reduced chances of defects in soldering processes
Commercial Applications: The technology can be applied in PCB manufacturing facilities, electronics assembly plants, and other industries requiring precise soldering processes.
Prior Art: Prior research in the field of solder printing apparatus and solder mask cleaning methods can provide insights into the development of this technology.
Frequently Updated Research: Ongoing research in soldering techniques, PCB manufacturing, and automation in electronics assembly may influence the further advancement of this technology.
Questions about Solder Printing Apparatus: 1. What are the key components of a solder printing apparatus? 2. How does the control unit optimize printing parameters based on cleaning cycle count?
Original Abstract Submitted
a solder printing apparatus including a printed circuit board feeding unit configured to sequentially feed a plurality of printed circuit boards, a solder paste printing unit configured to locate a solder mask on each of the printed circuit boards fed by the printed circuit board feeding unit and print solder paste on each of the printed circuit boards through an opening of the solder mask, a solder mask cleaning unit configured to clean residual solder from the solder mask after the solder paste is printed by the solder paste printing unit, and a control unit configured to control the solder paste printing unit and the solder mask cleaning unit, wherein the control unit is further configured to differently set a printing parameter of the solder paste printing unit for each of the printed circuit boards according to a cleaning cycle count set for the solder mask may be provided.
