Samsung electronics co., ltd. (20240215242). SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract
Contents
SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME
Organization Name
Inventor(s)
Suk Kang Sung of Suwon-si (KR)
SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240215242 titled 'SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME
The semiconductor memory device described in the abstract includes a cell substrate, a mold structure with gate electrodes, channel structures, and a cutting structure that cuts some of the gate electrodes.
- The cutting structure has a zigzag shape formed by connecting a first portion with a line shape in one direction and a second portion with a line shape in another direction.
- The cutting structure includes side walls with points connected to corresponding channel structures.
- The innovation allows for precise cutting of gate electrodes in a semiconductor memory device.
Potential Applications: - This technology can be applied in the manufacturing of semiconductor memory devices for various electronic devices. - It can improve the efficiency and performance of memory devices in smartphones, computers, and other gadgets.
Problems Solved: - Provides a method for cutting gate electrodes in a semiconductor memory device with precision. - Enhances the overall functionality and reliability of memory devices.
Benefits: - Improved accuracy in cutting gate electrodes. - Enhanced performance and efficiency of semiconductor memory devices. - Increased durability and longevity of memory devices.
Commercial Applications: Title: Precision Cutting Technology for Semiconductor Memory Devices This technology can be utilized by semiconductor manufacturers to enhance the quality and performance of memory devices, leading to better consumer electronics products. The market implications include improved competitiveness and customer satisfaction in the electronics industry.
Questions about Precision Cutting Technology for Semiconductor Memory Devices: 1. How does this technology improve the manufacturing process of semiconductor memory devices? This technology streamlines the process of cutting gate electrodes in memory devices, leading to enhanced efficiency and accuracy in production.
2. What are the potential benefits of using precision cutting technology in semiconductor memory devices? The benefits include improved performance, durability, and reliability of memory devices, ultimately enhancing the user experience and satisfaction.
Original Abstract Submitted
a semiconductor memory device may include a cell substrate, a mold structure including gate electrodes stacked on the cell substrate, a channel structures penetrating the mold structure; and a first cutting structure cutting some of the gate electrodes. the first cutting structure may include a first portion having a line shape extending in a first direction and a second portion having a line shape extending in a second direction. the first portion and the second portion may be alternately connected to form a zigzag shape. the first cutting structure may include a first side wall and a second side wall opposing the first side wall. a first point of the first side wall connected from the second portion to the first portion and a second point of the second side wall connected from the first portion to the second portion may be in corresponding channel structures among the channel structures.
