Samsung electronics co., ltd. (20240213430). SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract
Contents
SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME
Organization Name
Inventor(s)
Kwonjoong Kim of Suwon-si (KR)
SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240213430 titled 'SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME
The semiconductor light emitting device described in the patent application includes a substrate, a light emitting device on the substrate, pads on the upper surface of the substrate and the light emitting device, a bonding wire connecting the light emitting device to the substrate, and a seal covering at least one side surface of the light emitting device.
- The bonding wire has a unique structure, with portions extending at different angles to ensure secure connection between the light emitting device and the substrate.
- The seal protects the bonding wire and ensures the longevity of the device by preventing external elements from damaging the connection.
Potential Applications: - This technology can be used in various lighting applications, such as LED lights for residential, commercial, and industrial use. - It can also be applied in display technologies, such as LED screens for televisions, monitors, and digital signage.
Problems Solved: - Ensures a reliable and durable connection between the light emitting device and the substrate. - Protects the bonding wire from external factors that could compromise the functionality of the device.
Benefits: - Improved longevity and reliability of semiconductor light emitting devices. - Enhanced performance and durability in various lighting and display applications.
Commercial Applications: Title: Advanced Semiconductor Light Emitting Device for Enhanced Performance in Lighting and Display Applications This technology can be utilized by manufacturers of LED lights, displays, and other lighting products to enhance the quality and longevity of their products, leading to increased customer satisfaction and market competitiveness.
Prior Art: Readers can explore prior patents related to semiconductor light emitting devices, bonding wire structures, and sealing techniques to gain a deeper understanding of the technological advancements in this field.
Frequently Updated Research: Researchers are constantly working on improving the efficiency and performance of semiconductor light emitting devices, including advancements in bonding wire technology and sealing methods to further enhance the reliability and durability of these devices.
Questions about Semiconductor Light Emitting Devices: 1. How does the unique bonding wire structure in this technology improve the reliability of the connection between the light emitting device and the substrate? 2. What are the potential challenges in implementing this technology in mass production, and how can they be addressed effectively?
Original Abstract Submitted
a semiconductor light emitting device includes: a substrate; a light emitting device provided on an upper surface of the substrate; a first pad provided on the upper surface of the substrate; a second pad provided on the upper surface of the light emitting device; a bonding wire connecting the light emitting device to the substrate, the bonding wire including: a first portion connected to and extending in a vertical direction from the first pad; a second portion extending from the first portion and inclined at a first angle relative to the first portion; a third portion extending from the second portion and inclined at a second angle is in a range of from about 125 degrees to about 150 degrees relative to the second portion; and a fourth portion extending from the third portion, inclined at a third angle relative to the third portion, and connected to the second pad; and a seal covering at least one side surface of the light emitting device and sealing the bonding wire on the substrate.
