Samsung electronics co., ltd. (20240213317). SEMICONDUCTOR DEVICES INCLUDING PROTRUDING INSULATION PORTIONS BETWEEN ACTIVE FINS simplified abstract

SEMICONDUCTOR DEVICES INCLUDING PROTRUDING INSULATION PORTIONS BETWEEN ACTIVE FINS

Organization Name

samsung electronics co., ltd.

Inventor(s)

Shigenobu Maeda of Seongnam-si (KR)

Hee-Soo Kang of Seoul (KR)

Sang-Pil Sim of Seongnam-si (KR)

Soo-Hun Hong of Gunpo-si (KR)

SEMICONDUCTOR DEVICES INCLUDING PROTRUDING INSULATION PORTIONS BETWEEN ACTIVE FINS - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240213317 titled 'SEMICONDUCTOR DEVICES INCLUDING PROTRUDING INSULATION PORTIONS BETWEEN ACTIVE FINS

The semiconductor device described in the patent application includes a field insulation layer with a planar major surface and a protruding portion that extends a specific distance from the major surface in orthogonal directions. Multi-channel active fins are positioned on the field insulation layer, separated by the protruding portion, and a conductive layer crosses over the protruding portion between the active fins.

• The semiconductor device features a field insulation layer with a planar major surface and a protruding portion.
• Multi-channel active fins extend on the field insulation layer, separated by the protruding portion.
• A conductive layer extends from the uppermost surface of the protruding portion to cross over it between the active fins.

Potential Applications: - This technology could be used in the development of advanced semiconductor devices for various electronic applications. - It may find applications in the manufacturing of high-performance integrated circuits and microprocessors.

Problems Solved: - The technology addresses the need for improved performance and efficiency in semiconductor devices. - It helps in enhancing the functionality and reliability of electronic components.

Benefits: - Improved performance and efficiency in semiconductor devices. - Enhanced functionality and reliability of electronic components. - Potential for the development of more advanced and high-performance electronic devices.

Commercial Applications: Title: Advanced Semiconductor Device Technology for Enhanced Performance This technology could have commercial applications in the semiconductor industry for the production of high-performance integrated circuits and microprocessors. It may also be utilized in various electronic devices to improve their functionality and efficiency.

Questions about the technology: 1. How does the protruding portion of the field insulation layer contribute to the overall performance of the semiconductor device? The protruding portion helps in separating the multi-channel active fins and allows for the conductive layer to cross over, enhancing the functionality and efficiency of the device.

2. What are the potential market implications of implementing this advanced semiconductor device technology? The market implications could include the development of more advanced electronic devices with improved performance and reliability, potentially leading to increased demand in the semiconductor industry.

Original Abstract Submitted

a semiconductor device can include a field insulation layer including a planar major surface extending in first and second orthogonal directions and a protruding portion that protrudes a particular distance from the major surface relative to the first and second orthogonal directions. first and second multi-channel active fins can extend on the field insulation layer, and can be separated from one another by the protruding portion. a conductive layer can extend from an uppermost surface of the protruding portion to cross over the protruding portion between the first and second multi-channel active fins.