Samsung electronics co., ltd. (20240213192). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Kyongsoon Cho of Suwon-si (KR)
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240213192 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
The semiconductor package described in the abstract consists of a silicon substrate with through openings and a redistribution wiring layer with bonding pads, test pads, and landing pads.
- The silicon substrate has through openings for communication with the redistribution wiring layer.
- The redistribution wiring layer includes bonding pads on the first surface, test pads on the first surface, and landing pads on the second surface.
- The redistribution wiring layer has redistribution wires that connect the bonding pads and landing pads electrically.
Potential Applications: - This technology can be used in the manufacturing of semiconductor devices for various electronic applications. - It can be applied in the production of integrated circuits and microchips.
Problems Solved: - Provides a method for efficient electrical connections in semiconductor packages. - Enhances the performance and reliability of semiconductor devices.
Benefits: - Improved electrical connectivity in semiconductor packages. - Enhanced functionality and durability of semiconductor devices.
Commercial Applications: Title: Semiconductor Package Technology for Enhanced Electrical Connectivity This technology can be utilized in the production of consumer electronics, telecommunications equipment, and automotive electronics. It can also benefit the semiconductor industry by improving the performance of electronic devices.
Prior Art: Readers can explore prior art related to semiconductor packaging technologies, silicon substrates, and redistribution wiring layers in the field of semiconductor manufacturing.
Frequently Updated Research: Researchers are continuously working on enhancing the design and materials used in semiconductor packages to improve performance and reliability.
Questions about Semiconductor Package Technology: 1. How does this technology improve the electrical connectivity in semiconductor devices? - This technology enhances electrical connections through redistribution wiring layers and landing pads, improving overall device performance.
2. What are the potential applications of this semiconductor package technology? - This technology can be applied in various electronic devices, including integrated circuits, microchips, and consumer electronics.
Original Abstract Submitted
a semiconductor package includes a silicon substrate including a plurality of through openings, and a redistribution wiring layer including a first surface and a second surface opposite the first surface, the second surface facing the silicon substrate, the redistribution wiring layer including a first pad area and a second pad area. the redistribution wiring layer includes a plurality of bonding pads on the first pad area at the first surface, a plurality of test pads on the second pad area at the first surface, a plurality of landing pads on the second pad area at the second surface, the plurality of landing pads in communication with the plurality of through openings, respectively, and a plurality of redistribution wires electrically connected to the plurality of bonding pads and the plurality of landing pads.
