Samsung electronics co., ltd. (20240213143). SEMICONDUCTOR PACKAGES HAVING CAPACITORS simplified abstract
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SEMICONDUCTOR PACKAGES HAVING CAPACITORS
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGES HAVING CAPACITORS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240213143 titled 'SEMICONDUCTOR PACKAGES HAVING CAPACITORS
The semiconductor package described in the patent application consists of a package substrate, an interposer, connection terminals, two semiconductor chips, a bridge, and a capacitor structure within the interposer.
- The package substrate serves as the foundation for the semiconductor package.
- The interposer is positioned above the package substrate and facilitates connections between components.
- Connection terminals link the package substrate to the interposer.
- Two semiconductor chips are located above the interposer.
- A bridge within the interposer connects the two semiconductor chips.
- The capacitor structure within the interposer includes upper and lower capacitors.
- Chip connection terminals enable communication between the interposer and the semiconductor chips.
Potential Applications: - This technology could be utilized in advanced electronic devices such as smartphones, tablets, and computers. - It may find applications in the automotive industry for use in vehicle electronics. - The semiconductor package could be integrated into medical devices for improved performance.
Problems Solved: - Enhances connectivity and communication between semiconductor components. - Improves the efficiency and functionality of electronic devices. - Provides a compact and reliable packaging solution for semiconductor chips.
Benefits: - Increased performance and speed of electronic devices. - Enhanced reliability and durability of semiconductor components. - Enables the development of smaller and more efficient electronic products.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Device Performance This technology could be commercialized in the consumer electronics market, automotive industry, and medical device sector. It offers a competitive advantage by improving the performance and reliability of electronic devices.
Questions about the technology: 1. How does the capacitor structure within the interposer contribute to the overall functionality of the semiconductor package? 2. What are the specific advantages of using an interposer in semiconductor packaging?
Original Abstract Submitted
a semiconductor package includes a package substrate, an interposer above the package substrate, a connection terminal between the package substrate and the interposer, a first semiconductor chip and a second semiconductor chip above the interposer, a bridge in the interposer, the bridge connected to the first semiconductor chip and the second semiconductor chip, a capacitor structure in the interposer, the capacitor structure including an upper structure including an upper capacitor and a lower structure including a lower capacitor, and a chip connection terminal including at least one first chip connection terminal between the interposer and the first semiconductor chip and at least one second chip connection terminal between the interposer and the second semiconductor chip.
