Samsung electronics co., ltd. (20240213133). REDISTRIBUTION SUBSTRATE, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF FABRICATING REDISTRIBUTION SUBSTRATE simplified abstract
REDISTRIBUTION SUBSTRATE, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF FABRICATING REDISTRIBUTION SUBSTRATE
Organization Name
Inventor(s)
Hyungjun Park of Suwon-si (KR)
Seong-Hoon Bae of Suwon-si (KR)
Sang-Hyuck Oh of Suwon-si (KR)
Kwangok Jeong of Suwon-si (KR)
REDISTRIBUTION SUBSTRATE, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF FABRICATING REDISTRIBUTION SUBSTRATE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240213133 titled 'REDISTRIBUTION SUBSTRATE, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF FABRICATING REDISTRIBUTION SUBSTRATE
The patent application describes a redistribution substrate with multiple insulating layers, a wiring layer, and a metal layer.
- The wiring pattern includes a via portion and a pad portion, with the pad portion extending onto the upper surface of the first insulating layer.
- The metal layer covers the upper surface of the wiring pattern, with a concentration of the first metal in the metal layer varying between different portions.
- The second insulating layer is provided on top of the first insulating layer, covering the pad portion and the metal layer.
- The metal layer includes a first portion vertically overlapping the pad portion, and a second portion surrounding the first portion.
- The concentration of the first metal in the first portion of the metal layer is greater than in the second portion.
Potential Applications: - This technology can be used in semiconductor devices and integrated circuits. - It can improve the performance and reliability of electronic components.
Problems Solved: - Provides better electrical connectivity and insulation in semiconductor devices. - Enhances the durability and longevity of integrated circuits.
Benefits: - Improved signal transmission and reduced signal interference. - Enhanced overall performance and efficiency of electronic devices.
Commercial Applications: - This technology can be applied in the manufacturing of various electronic devices such as smartphones, computers, and automotive electronics.
Questions about the technology: 1. How does the redistribution substrate improve the performance of semiconductor devices? 2. What are the key advantages of using this technology in integrated circuits?
Original Abstract Submitted
a redistribution substrate includes first and second insulating layers; a wiring layer, and a metal layer. the wiring pattern includes a via portion penetrating the first insulating layer and a pad portion on the via portion, the pad portion extending onto an upper surface of the first insulating layer. the metal layer covers an upper surface of the wiring pattern. the second insulating layer is provided on the first insulating layer and covers the pad portion and the metal layer. the wiring pattern includes a first metal. the metal layer includes the first metal and a second metal. the metal layer includes a first portion vertically overlapping the pad portion, and a second portion surrounding the first portion, and a concentration of the first metal in the first portion of the metal layer is greater than a concentration of the first metal in the second portion of the metal layer.
