Samsung electronics co., ltd. (20240213071). ELECTROSTATIC CHUCK simplified abstract
Contents
ELECTROSTATIC CHUCK
Organization Name
Inventor(s)
Younseon Wang of SUWON-SI (KR)
ELECTROSTATIC CHUCK - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240213071 titled 'ELECTROSTATIC CHUCK
The abstract describes an electrostatic chuck with a unique design to prevent reaction gas permeation.
- Electrostatic chuck body with a step portion and an adhesive layer.
- Ceramic puck adhered to the adhesive layer with an edge protruding.
- Sealant between the step portion and the edge of the ceramic puck.
- Sealant includes a coating layer with a metal oxide, rare earth oxide, and/or multilayer heterogeneous metal oxide.
Potential Applications: - Semiconductor manufacturing - Thin film deposition processes - Wafer bonding in microelectronics
Problems Solved: - Preventing reaction gas permeation - Ensuring secure adhesion of ceramic puck - Enhancing the performance of electrostatic chucks
Benefits: - Improved process reliability - Enhanced wafer handling capabilities - Extended equipment lifespan
Commercial Applications: Title: Advanced Electrostatic Chuck for Semiconductor Manufacturing This technology can be used in semiconductor fabrication facilities to improve wafer handling and processing efficiency, leading to higher yields and reduced downtime.
Prior Art: Further research can be conducted in the field of electrostatic chucks, sealants, and materials used in semiconductor manufacturing processes.
Frequently Updated Research: Researchers are constantly exploring new materials and designs for electrostatic chucks to enhance their performance and reliability.
Questions about the Technology: 1. How does the design of this electrostatic chuck differ from traditional designs? 2. What specific benefits does the rare earth oxide coating provide in the sealant layer?
Original Abstract Submitted
an electrostatic chuck includes an electrostatic chuck body having a step portion protruding from a lower end, an adhesive layer disposed on an upper surface of the electrostatic chuck body, a ceramic puck adhered to the adhesive layer and having an edge protruding from the upper surface of the electrostatic chuck body, and a sealant disposed between the step portion and the edge of the ceramic puck and configured to block reaction gas from permeating into the adhesive layer. the sealant includes a coating layer disposed on an external surface thereof, and the coating layer includes a metal oxide including a single rare earth oxide and/or a multilayer heterogeneous metal oxide.
