Samsung electronics co., ltd. (20240212992). PLASMA PROCESSING APPARATUS AND METHOD simplified abstract

PLASMA PROCESSING APPARATUS AND METHOD

Organization Name

samsung electronics co., ltd.

Inventor(s)

Changheon Lee of Suwon-si (KR)

Sangki Nam of Suwon-si (KR)

Kuihyun Yoon of Suwon-si (KR)

Kiho Lee of Suwon-si (KR)

Sangho Lee of Suwon-si (KR)

Sangheun Lee of Suwon-si (KR)

Jaemin Rhee of Suwon-si (KR)

Junghyun Cho of Suwon-si (KR)

Seoyeon Choi of Suwon-si (KR)

PLASMA PROCESSING APPARATUS AND METHOD - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240212992 titled 'PLASMA PROCESSING APPARATUS AND METHOD

Simplified Explanation: The patent application describes a plasma processing apparatus with a substrate chuck, a restriction ring, a movable ring, and an actuator to control the movement of the rings, allowing for the opening or closing of grooves in the restriction ring.

• The plasma processing apparatus includes a substrate chuck, a restriction ring, a movable ring, and an actuator.
• The movable ring can open or close grooves in the restriction ring.
• The movement of the rings is controlled by the actuator.

Key Features and Innovation:

• Innovative design of the plasma processing apparatus with movable rings for controlling grooves in the restriction ring.
• Enhanced precision and control over plasma processing due to the movable ring mechanism.
• Improved efficiency in plasma processing operations.

Potential Applications:

• Semiconductor manufacturing
• Thin film deposition
• Surface treatment processes

Problems Solved:

• Lack of precise control in plasma processing operations.
• Inefficient substrate handling during plasma processing.
• Limited flexibility in adjusting processing parameters.

Benefits:

• Increased accuracy and precision in plasma processing.
• Enhanced efficiency and productivity in manufacturing processes.
• Improved quality and consistency of processed materials.

Commercial Applications: Plasma processing apparatus can be utilized in various industries such as semiconductor manufacturing, electronics, and materials science for precise and efficient processing operations, leading to cost savings and improved product quality.

Questions about Plasma Processing Apparatus: 1. How does the movable ring mechanism improve the control over plasma processing operations? 2. What are the potential cost-saving benefits of using this plasma processing apparatus in semiconductor manufacturing?

Original Abstract Submitted

provided is a plasma processing apparatus including a substrate chuck in a chamber, a restriction ring surrounding an outer perimeter of the substrate chuck, a movable ring on the restriction ring, and an actuator configured to move the movable ring, wherein grooves formed in the restriction ring are opened or closed by movement of the movable ring. in addition, provided is a plasma processing method using the plasma processing apparatus.