Samsung electronics co., ltd. (20240210473). SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract
Contents
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Organization Name
Inventor(s)
Jaeyong Jeong of Suwon-si (KR)
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240210473 titled 'SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
The semiconductor chip described in the patent application features a wiring structure along the edge of the chip, a clock counter, and an oscillator.
- The clock counter sends a test signal to a first node of the wiring structure and receives the signal from a second node.
- An oscillator provides a clock signal to the clock counter, which counts the number of clocks from when the test signal is sent to when it is received, then outputs a resultant signal to a controller based on this count.
Key Features and Innovation:
- Integration of a clock counter and oscillator for testing signals in a semiconductor chip.
- Efficient method of measuring signal transmission time within the chip's wiring structure.
Potential Applications:
- Quality control in semiconductor manufacturing.
- Testing and debugging of complex integrated circuits.
Problems Solved:
- Ensuring signal integrity and reliability in semiconductor chips.
- Streamlining testing processes for faster production cycles.
Benefits:
- Improved accuracy in signal testing.
- Enhanced efficiency in identifying and resolving wiring issues.
Commercial Applications:
- This technology could be valuable in the semiconductor industry for optimizing chip performance and reliability.
Prior Art:
- Researchers and engineers in the semiconductor field may find relevant prior art in studies related to clock counters and signal testing in integrated circuits.
Frequently Updated Research:
- Stay informed on the latest advancements in semiconductor testing methodologies and technologies.
Questions about the technology: 1. How does the clock counter interact with the wiring structure to test signals? 2. What are the potential implications of this technology on semiconductor chip design and manufacturing processes?
Original Abstract Submitted
a semiconductor chip includes a wiring structure arranged along an edge of the semiconductor chip; a clock counter configured to output a test signal to a first node of the wiring structure and receive the test signal from a second node of the wiring structure; and an oscillator configured to output a first clock signal to the clock counter, where the clock counter is configured to count a number of clocks of the first clock signal as a first count value from a first time in which the test signal is output to the first node of the wiring structure to a second time in which the test signal is received from the second node of the wiring structure, and output a first resultant signal to a controller based on the first count value.
