Samsung electronics co., ltd. (20240208005). CLEANER FOR CHEMICAL MECHANICAL POLISHING APPARATUS simplified abstract
Contents
CLEANER FOR CHEMICAL MECHANICAL POLISHING APPARATUS
Organization Name
Inventor(s)
Sungyong Park of Suwon-si (KR)
Hyunjoon Park of Suwon-si (KR)
CLEANER FOR CHEMICAL MECHANICAL POLISHING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240208005 titled 'CLEANER FOR CHEMICAL MECHANICAL POLISHING APPARATUS
The patent application describes a cleaner for a CMP (Chemical Mechanical Polishing) apparatus that includes a cleaning body, cleaning nozzles, a vision system, and a controller. The cleaner is designed to prevent scratches on the substrate during the polishing process.
- The cleaning body is positioned under the polishing head of the CMP apparatus and is used to apply a cleaning solution to the polishing head.
- Multiple cleaning nozzles are located on the cleaning body to inject the cleaning solution onto the polishing head.
- A vision system captures images of the polishing head to help the controller adjust the amount of cleaning solution sprayed by each cleaning nozzle.
- By individually controlling the cleaning solution flow based on the images, the cleaner prevents defects and scratches on the substrate.
Potential Applications: - Semiconductor manufacturing - Microelectronics industry - Precision optics manufacturing
Problems Solved: - Preventing scratches and defects on substrates during the CMP process - Improving the efficiency and effectiveness of cleaning in CMP apparatus
Benefits: - Enhanced substrate quality - Reduced maintenance costs - Improved overall process efficiency
Commercial Applications: Title: Advanced Cleaner for CMP Apparatus: Market Implications and Commercial Uses Description: This technology can be utilized in semiconductor fabrication facilities, microelectronics manufacturing plants, and precision optics production facilities to enhance cleaning processes and prevent defects on substrates.
Questions about the technology: 1. How does the vision system help improve the cleaning process in the CMP apparatus?
The vision system captures images of the polishing head to adjust the cleaning solution flow, ensuring precise and effective cleaning.
2. What are the potential cost-saving benefits of using this advanced cleaner in CMP apparatus?
The technology can reduce maintenance costs by preventing scratches and defects on substrates, leading to higher substrate quality and lower rework expenses.
Original Abstract Submitted
a cleaner for a cmp apparatus includes a cleaning body, a plurality of cleaning nozzles, a vision system and a controller. the cleaning body may be arranged under a polishing head of the cmp apparatus configured to hold a substrate. the cleaning body may be configured to receive a cleaning solution for cleaning the polishing head. the cleaning nozzles may be arranged at the cleaning body to inject the cleaning solutions to the polishing head. the vision system may photograph the polishing head to which the cleaning solution may be injected to obtain an image of the polishing head. the controller may individually control amounts of the cleaning solutions injected from the cleaning nozzles based on the image of the polishing head. thus, a scratch caused by a defect may not be generated at the substrate.
