Samsung electronics co., ltd. (20240206068). PRINTED CIRCUIT BOARD simplified abstract
Contents
PRINTED CIRCUIT BOARD
Organization Name
Inventor(s)
Yang Liu of Suzhou Industrial Park (CN)
Zhenrong Yang of Suzhou Industrial Park (CN)
PRINTED CIRCUIT BOARD - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240206068 titled 'PRINTED CIRCUIT BOARD
The abstract of the patent application describes a printed circuit board divided into a printed circuit board area and a peripheral area, with unit printed circuit boards in the former and a base portion in the latter.
- The printed circuit board includes multiple unit printed circuit boards in the printed circuit board area.
- The base portion, located in the peripheral area and the printed circuit board area, consists of a circuit pattern portion and an insulating material portion.
- A first solder resist portion is on both surfaces of the base portion in the peripheral area, while a second solder resist portion is in the printed circuit board area.
- The first solder resist portion surrounds the second solder resist portion and contains a first filler, while the second solder resist portion contains a different second filler.
Potential Applications: - Electronics manufacturing - Circuit board assembly - Consumer electronics
Problems Solved: - Efficient organization of unit printed circuit boards - Improved solder resist application - Enhanced durability and insulation
Benefits: - Space-saving design - Enhanced circuit board reliability - Streamlined manufacturing process
Commercial Applications: Title: "Innovative Printed Circuit Board Design for Enhanced Electronics Manufacturing" This technology can be utilized in industries such as consumer electronics, automotive electronics, and telecommunications for improved circuit board assembly processes and product reliability.
Questions about the technology: 1. How does the design of the base portion contribute to the overall functionality of the printed circuit board? 2. What are the specific advantages of using different fillers in the first and second solder resist portions?
Original Abstract Submitted
a printed circuit board, divided into a printed circuit board area and a peripheral area surrounding the printed circuit board area, includes: a plurality of unit printed circuit boards provided in the printed circuit board area; a base portion provided in the peripheral area and the printed circuit board area, and including a circuit pattern portion and an insulating material portion; a first solder resist portion provided in the peripheral area on a first surface of the base portion and a second surface of the base portion, the first surface being opposite to the second surface; and a second solder resist portion provided in the printed circuit board area on the first surface of the base portion and the second surface of the base portion. the first solder resist portion surrounds the second solder resist portion in the printed circuit board area. the first solder resist portion includes a first filler and the second solder resist portion includes a second filler that is different from the first filler.
