Samsung electronics co., ltd. (20240205530). ELECTRONIC DEVICE COMPRISING CAMERA MODULE simplified abstract
Contents
ELECTRONIC DEVICE COMPRISING CAMERA MODULE
Organization Name
Inventor(s)
ELECTRONIC DEVICE COMPRISING CAMERA MODULE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240205530 titled 'ELECTRONIC DEVICE COMPRISING CAMERA MODULE
Simplified Explanation: The camera module described in the patent application includes a rigid printed circuit board (RPCB) with a metal plate attached underneath, containing holes for a multi-layer ceramic condenser (MLCC) and an image sensor.
Key Features and Innovation:
- Camera module structure with RPCB, metal plate, MLCC, and image sensor.
- MLCC placed in holes on the RPCB, below the image sensor.
- Improved space utilization without the need for a separate mounting space for the MLCC.
Potential Applications: This technology can be used in various electronic devices requiring compact camera modules, such as smartphones, tablets, laptops, and security cameras.
Problems Solved: The innovation addresses the challenge of optimizing space in camera modules by integrating the MLCC without requiring additional mounting space.
Benefits:
- Enhanced space efficiency in camera module design.
- Simplified assembly process.
- Improved overall performance of electronic devices.
Commercial Applications: The technology can be applied in the consumer electronics industry for manufacturing compact and efficient camera modules, potentially impacting the market for smartphones, tablets, and other devices.
Prior Art: Readers can explore prior art related to camera module design, MLCC integration, and space optimization in electronic devices to understand the novelty of this innovation.
Frequently Updated Research: Stay informed about advancements in camera module technology, MLCC integration, and space-saving solutions in electronic devices for potential future developments.
Questions about Camera Module Technology: 1. How does the integration of MLCC in the camera module improve space utilization? 2. What are the potential challenges in implementing this technology in different electronic devices?
Original Abstract Submitted
a camera module according to an embodiment of the present disclosure may comprise: a rigid printed circuit board (rpcb), a metal plate coupled to the lower surface of the rpcb and having one or more holes formed therein, a multi-layer ceramic condenser (mlcc) disposed in the one or more holes in the rpcb, and an image sensor disposed on the metal plate. with reference to the lower surface of the rpcb, the mlcc may be formed to have a height less than the height of the metal plate. a camera module structure according to an embodiment of the present disclosure may comprise: a flexible printed circuit board (fpcb), an rpcb coupled to the lower surface of the fpcb and having one or more first holes formed therein, a metal plate coupled to the lower surface of the rpcb and having one or more second holes formed in areas corresponding to the first holes, respectively, an mlcc disposed in the first holes and the second holes below the fpcb, and an image sensor disposed on the metal plate. the mlcc may be disposed in at least one of spaces formed through the first holes and the second holes. according to various embodiments of the present disclosure, a different camera module structure may be utilized such that no separate space is necessary to mount a laminated ceramic capacitor, and space utilization may be improved.
