Samsung electronics co., ltd. (20240204107). SEMICONDUCTOR DEVICE simplified abstract
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Sang Koo Kang of Suwon-si (KR)
Woo Kyung You of Suwon-si (KR)
Koung Min Ryu of Suwon-si (KR)
Hoon Seok Seo of Suwon-si (KR)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240204107 titled 'SEMICONDUCTOR DEVICE
The semiconductor device described in the abstract includes a substrate with active patterns, a field insulating film, power rails, a semiconductor etching stop pattern, and semiconductor patterns.
- The device features active patterns spaced apart on the substrate, covered by a field insulating film.
- Power rails are positioned adjacent to the active patterns, with power rail vias connecting to the power rails.
- A semiconductor etching stop pattern is located next to one of the active patterns.
- Semiconductor patterns are placed on the semiconductor etching stop pattern, with part of them in the field insulating film.
- The lower surface of the semiconductor etching stop pattern aligns with the lower side of the substrate.
Potential Applications: - This technology can be used in the manufacturing of advanced semiconductor devices. - It may find applications in the electronics industry for high-performance integrated circuits.
Problems Solved: - Provides a method for precise positioning and connection of semiconductor components. - Enhances the efficiency and reliability of semiconductor device fabrication processes.
Benefits: - Improved accuracy and alignment of semiconductor components. - Increased performance and functionality of semiconductor devices.
Commercial Applications: - This technology could be valuable for semiconductor manufacturers looking to enhance their product offerings with more advanced features and capabilities.
Questions about the Technology: 1. How does the placement of the power rails and semiconductor etching stop pattern contribute to the overall functionality of the device? 2. What are the potential challenges in scaling up the production of semiconductor devices using this technology?
Frequently Updated Research: - Stay informed about the latest advancements in semiconductor manufacturing techniques and materials to optimize the performance of devices utilizing this technology.
Original Abstract Submitted
a semiconductor device includes: a substrate including an upper side and a lower side; first and second active patterns spaced apart from each other; a field insulating film covering side walls of the first and second active patterns; a power rail disposed adjacent to a first side wall of the second active pattern and between the first active pattern and the second active pattern; a power rail via disposed on the power rail and connected to the power rail; a semiconductor etching stop pattern disposed adjacent to a second side wall of the second active pattern; and a first semiconductor pattern disposed on the semiconductor etching stop pattern, wherein a lower surface of the semiconductor etching stop pattern is disposed on substantially a same plane as the lower side of the substrate, and wherein at least part of the first semiconductor pattern is disposed in the field insulating film.
