Samsung electronics co., ltd. (20240204026). IMAGE SENSOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME simplified abstract
Contents
IMAGE SENSOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
Organization Name
Inventor(s)
JUNGHOON Kang of Suwon-si (KR)
UN-BYOUNG Kang of Suwon-si (KR)
SEUNGWAN Shin of Suwon-si (KR)
JUNG HYUN Lee of Suwon-si (KR)
IMAGE SENSOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240204026 titled 'IMAGE SENSOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
Simplified Explanation: The image sensor package described in the patent application consists of a substrate with a metal portion, an image sensor chip mounted on the substrate, and a transparent glass cover that seals the image sensor chip.
Key Features and Innovation:
- Substrate with a metal portion
- Image sensor chip mounted on the substrate
- Transparent glass cover with an upper plate and sidewalls
- Sidewalls directly bonded to the metal portion of the substrate
- Image sensor chip sealed by the transparent glass cover and the substrate
Potential Applications: This technology can be used in various imaging devices such as cameras, smartphones, and medical imaging equipment.
Problems Solved: The image sensor package provides a protective and sealed environment for the image sensor chip, preventing damage and contamination.
Benefits:
- Enhanced durability and protection for the image sensor chip
- Improved image quality and reliability in imaging devices
- Sealed environment prevents dust and debris from affecting sensor performance
Commercial Applications: The image sensor package can be utilized in the consumer electronics industry for manufacturing high-quality cameras and smartphones with superior imaging capabilities.
Prior Art: Prior art related to this technology may include patents or research papers on image sensor packaging and protection methods in electronic devices.
Frequently Updated Research: Researchers may be conducting studies on advancements in image sensor packaging materials and techniques to further improve durability and performance.
Questions about Image Sensor Package: 1. How does the transparent glass cover enhance the protection of the image sensor chip? 2. What are the potential cost implications of implementing this image sensor package in mass-produced electronic devices?
Original Abstract Submitted
an image sensor package according to an embodiment includes: a substrate including a metal portion; an image sensor chip on the substrate; and a transparent glass cover disposed on the substrate and including an upper plate and sidewalls, the upper plate and the sidewalls defined by a cavity at a lower portion and spaced from the image sensor chip, wherein the sidewalls are directly bonded to the metal portion of the substrate, and the image sensor chip is sealed by the transparent glass cover and the substrate.
