Samsung electronics co., ltd. (20240204009). FILM PACKAGE AND DISPLAY MODULE INCLUDING SAME simplified abstract
Contents
FILM PACKAGE AND DISPLAY MODULE INCLUDING SAME
Organization Name
Inventor(s)
Seunghyun Cho of Suwon-si (KR)
FILM PACKAGE AND DISPLAY MODULE INCLUDING SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240204009 titled 'FILM PACKAGE AND DISPLAY MODULE INCLUDING SAME
The patent application describes a film package that includes a film substrate with semiconductor chips, input terminals, output terminals, wirings, and a protective layer.
- Film substrate with first and second side surfaces extending in different directions.
- Semiconductor chip(s) placed on the film substrate and extending lengthwise.
- Input terminals on the first side surface and output terminals on the second side surface.
- Wirings on the film substrate connecting the input and output terminals to the semiconductor chip(s).
- Protective layer covering the wirings on the film substrate.
Potential Applications: - Integrated circuits - Electronic devices - Semiconductor packaging
Problems Solved: - Efficient electrical connections in semiconductor packaging - Protection of wirings on film substrates
Benefits: - Improved performance of electronic devices - Enhanced durability of semiconductor packaging
Commercial Applications: - Semiconductor industry - Electronics manufacturing
Questions about Film Package Technology: 1. How does the protective layer enhance the durability of the film package? 2. What are the advantages of having input and output terminals on different sides of the film substrate?
Original Abstract Submitted
a film package includes: a film substrate having a first side surface and a second side surface opposing each other in a first direction, each of the first side surface and the second side surface extending in a second direction perpendicular to the first direction; at least one semiconductor chip disposed on the film substrate and extending lengthwise in the first direction; input terminals arranged on the film substrate along the first side surface, output terminals arranged on the film substrate along the second side surface, and wirings formed on the film substrate and electrically connecting the input terminals and the output terminals to the at least one semiconductor chip; and a protective layer covering the wirings on the film substrate.
