Samsung electronics co., ltd. (20240203964). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240203964 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application consists of a lower substrate, a lower device positioned at the center of the lower substrate, an upper substrate placed on the lower device and the lower substrate, and multiple post electrodes connecting the lower substrate to the upper substrate. Additionally, there are passive devices located between the post electrodes and the edge of the lower substrate, connecting the post electrodes to the lower substrate.
- Lower substrate
- Lower device at the center of the lower substrate
- Upper substrate on the lower device and lower substrate
- Multiple post electrodes connecting lower substrate to upper substrate
- Passive devices between post electrodes and edge of lower substrate
Potential Applications: - Semiconductor industry for electronic devices - Integrated circuits - Microelectronics
Problems Solved: - Improved connectivity between substrates - Enhanced performance of semiconductor devices
Benefits: - Increased efficiency in electronic devices - Better overall performance - Enhanced durability and reliability
Commercial Applications: Title: "Advanced Semiconductor Packaging Technology for Enhanced Device Performance" This technology can be utilized in various commercial applications such as: - Consumer electronics - Telecommunications - Automotive industry
Questions about the technology: 1. How does the placement of the post electrodes improve the connectivity between the substrates? 2. What are the specific advantages of using passive devices in this semiconductor package design?
Frequently Updated Research: Stay updated on the latest advancements in semiconductor packaging technology to ensure optimal performance and reliability in electronic devices.
Original Abstract Submitted
a semiconductor package includes a lower substrate, a lower device on a center of the lower substrate, an upper substrate on the lower device and the lower substrate, and a plurality of post electrodes between a region adjacent an edge of the lower substrate and a region adjacent an edge of the upper substrate. the plurality of post electrodes connect the lower substrate to the upper substrate. a plurality of passive devices are between the plurality of post electrodes and the region adjacent the edge of the lower substrate and connect the plurality of post electrodes to the lower substrate.
