Samsung electronics co., ltd. (20240203961). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Hyeonjeong Hwang of Suwon-si (KR)
Kyoung Lim Suk of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240203961 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the abstract includes a first redistribution substrate, a semiconductor chip, a mold layer, a first passive device, an insulating pattern, and a second redistribution substrate.
- The first redistribution substrate supports the semiconductor chip.
- The mold layer covers the semiconductor chip and has a first opening exposing a portion of the chip's top surface.
- The first passive device is placed on the exposed portion of the semiconductor chip.
- An insulating pattern fills the first opening and covers part of the first passive device.
- The second redistribution substrate is positioned on top of the mold layer.
Potential Applications: - This technology can be used in the manufacturing of advanced semiconductor packages for various electronic devices. - It can improve the performance and reliability of integrated circuits in applications such as smartphones, computers, and automotive electronics.
Problems Solved: - Enhances the electrical connectivity and thermal management of semiconductor devices. - Provides a more efficient and compact packaging solution for complex electronic systems.
Benefits: - Increased functionality and performance of semiconductor devices. - Improved reliability and durability of electronic products. - Cost-effective manufacturing process for advanced semiconductor packages.
Commercial Applications: - This technology can be applied in the production of high-performance consumer electronics, automotive electronics, and industrial equipment. - It has the potential to drive innovation in the semiconductor packaging industry and meet the growing demand for smaller, more powerful electronic devices.
Questions about Semiconductor Package Technology: 1. How does the insulating pattern contribute to the overall performance of the semiconductor package? 2. What are the key advantages of using a mold layer in semiconductor packaging?
Frequently Updated Research: - Stay updated on the latest advancements in semiconductor packaging technology to ensure optimal performance and reliability in electronic devices.
Original Abstract Submitted
a semiconductor package may include a first redistribution substrate, a semiconductor chip disposed on the first redistribution substrate, a mold layer covering the semiconductor chip and including a first opening exposing a portion of a top surface of the semiconductor chip, a first passive device disposed on the portion of the top surface of the semiconductor chip exposed by the first opening, an insulating pattern filling the first opening and covering at least a portion of the first passive device, and a second redistribution substrate disposed on the mold layer. the first passive device may be spaced apart from the mold layer, with the insulating pattern interposed therebetween.
