Samsung electronics co., ltd. (20240203960). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
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Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240203960 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the abstract consists of a first semiconductor chip, a connection die positioned next to a side surface of the first semiconductor chip, and a second semiconductor chip placed on top of the first semiconductor chip and the connection die. The first semiconductor chip contains a number of first through electrodes, while the connection die includes a plurality of second through electrodes. These electrodes are situated below and vertically overlap the second semiconductor chip.
- The semiconductor package features a unique design with multiple semiconductor chips and connection dies stacked vertically.
- The first semiconductor chip and the connection die have through electrodes that facilitate vertical overlap with the second semiconductor chip.
- This configuration allows for efficient connectivity and communication between the semiconductor chips within the package.
- The design potentially enables higher performance and functionality in electronic devices that utilize this semiconductor package.
- The vertical stacking of components optimizes space utilization and can lead to more compact and streamlined device designs.
Potential Applications: - This technology could be applied in various electronic devices such as smartphones, tablets, and laptops. - It may find use in automotive electronics, IoT devices, and industrial equipment that require compact and high-performance semiconductor packages.
Problems Solved: - The semiconductor package addresses the need for efficient vertical stacking of semiconductor chips in a compact form factor. - It solves the challenge of optimizing space utilization while maintaining effective connectivity between components.
Benefits: - Improved performance and functionality in electronic devices. - Space-saving design for more compact and sleek devices. - Enhanced connectivity and communication between semiconductor chips.
Commercial Applications: Title: Innovative Semiconductor Package Design for Enhanced Device Performance This technology could be commercially utilized in the consumer electronics industry to develop high-performance smartphones, tablets, and other portable devices. It may also have applications in automotive electronics and industrial equipment where space optimization and performance are crucial.
Questions about Semiconductor Package Design: 1. How does the vertical stacking of semiconductor chips benefit device performance? 2. What are the potential challenges in implementing this semiconductor package design in mass-produced electronic devices?
Frequently Updated Research: Stay updated on the latest advancements in semiconductor packaging technologies to understand how this innovation fits into the evolving landscape of electronic device design and manufacturing.
Original Abstract Submitted
a semiconductor package includes a first semiconductor chip, a connection die adjacent a side surface of the first semiconductor chip, and a second semiconductor chip on the first semiconductor chip and the connection die. the first semiconductor chip includes a plurality of first through electrodes. the connection die includes a plurality of second through electrodes. the first through electrodes and the second through electrodes are below and vertically overlap the second semiconductor chip.
