Samsung electronics co., ltd. (20240203946). SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND WAFER DICING METHOD simplified abstract
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SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND WAFER DICING METHOD
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SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND WAFER DICING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240203946 titled 'SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND WAFER DICING METHOD
The abstract of the patent application describes a semiconductor chip with a semiconductor substrate that has an active surface and an inactive surface. A semiconductor device layer is placed on the active surface, and a modified region covers the entire lateral side surface of the semiconductor substrate.
- The semiconductor chip features a semiconductor substrate with active and inactive surfaces.
- A semiconductor device layer is located on the active surface of the substrate.
- A modified region covers the entirety of the lateral side surface of the semiconductor substrate.
Potential Applications: - This technology could be used in the manufacturing of advanced semiconductor devices. - It may find applications in the development of high-performance electronic components.
Problems Solved: - Provides enhanced protection and functionality to semiconductor chips. - Improves the overall performance and durability of semiconductor devices.
Benefits: - Increased efficiency and reliability of semiconductor chips. - Enhanced protection against external factors for semiconductor devices.
Commercial Applications: Title: Advanced Semiconductor Chip Technology for Enhanced Performance This technology could be utilized in the production of cutting-edge electronic devices, leading to improved performance and durability. The market implications include the potential for increased demand for high-quality semiconductor chips in various industries.
Prior Art: Readers can explore existing patents related to semiconductor chip technology to gain a deeper understanding of the innovation presented in this application.
Frequently Updated Research: Stay informed about the latest advancements in semiconductor chip technology by following research publications and industry developments in the field.
Questions about Semiconductor Chip Technology: 1. How does the modified region on the lateral side surface of the semiconductor substrate enhance the overall performance of the chip? 2. What specific advantages does the semiconductor device layer provide in terms of functionality and protection for the chip?
Original Abstract Submitted
a semiconductor chip includes a semiconductor substrate having an active surface and an inactive surface opposite the active surface. a semiconductor device layer is disposed on the active surface. a modified region is positioned on an entirety of a lateral side surface of the semiconductor substrate.
