Samsung electronics co., ltd. (20240203943). CHIP STACK STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract
Contents
- 1 CHIP STACK STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 CHIP STACK STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Key Features and Innovation
- 1.6 Potential Applications
- 1.7 Problems Solved
- 1.8 Benefits
- 1.9 Commercial Applications
- 1.10 Questions about Chip Stack Structure
- 1.11 Original Abstract Submitted
CHIP STACK STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Organization Name
Inventor(s)
Junhyoung Kim of Suwon-si (KR)
CHIP STACK STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240203943 titled 'CHIP STACK STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Simplified Explanation
The patent application describes a chip stack structure consisting of two semiconductor chips bonded together, as well as a semiconductor package with multiple stacked chip stack structures.
- The invention involves a unique chip stack structure with two semiconductor chips bonded vertically.
- The semiconductor package includes multiple chip stack structures stacked in a vertical direction.
Key Features and Innovation
- Novel chip stack structure with two semiconductor chips bonded together.
- Semiconductor package with multiple stacked chip stack structures.
- Vertical stacking of chip stack structures for efficient use of space.
Potential Applications
The technology can be applied in various industries such as electronics, telecommunications, and computing for compact and efficient chip integration.
Problems Solved
- Efficient use of space in semiconductor packaging.
- Enhanced performance and functionality of integrated circuits.
- Simplified manufacturing processes for semiconductor devices.
Benefits
- Improved chip integration and performance.
- Space-saving design for compact electronic devices.
- Streamlined manufacturing processes for semiconductor packages.
Commercial Applications
- The technology can be utilized in the production of smartphones, tablets, and other electronic devices for improved performance and compact design.
Questions about Chip Stack Structure
1. How does the vertical stacking of chip stack structures benefit semiconductor packaging?
- The vertical stacking optimizes space utilization and enhances performance in semiconductor devices.
2. What are the potential applications of the chip stack structure in the electronics industry?
- The technology can be applied in various electronic devices for compact and efficient chip integration.
Original Abstract Submitted
the inventive concept provides a chip stack structure including a first semiconductor chip and a second semiconductor chip bonded to each other, and a semiconductor package including a plurality of chip stack structures stacked in a vertical direction.
