Samsung electronics co., ltd. (20240203883). INTEGRATED CIRCUIT DEVICE simplified abstract
Contents
- 1 INTEGRATED CIRCUIT DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 INTEGRATED CIRCUIT DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Key Features and Innovation
- 1.6 Potential Applications
- 1.7 Problems Solved
- 1.8 Benefits
- 1.9 Commercial Applications
- 1.10 Prior Art
- 1.11 Frequently Updated Research
- 1.12 Questions about Interconnection Structures
- 1.13 Original Abstract Submitted
INTEGRATED CIRCUIT DEVICE
Organization Name
Inventor(s)
Seungyong Yoo of Suwon-si (KR)
INTEGRATED CIRCUIT DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240203883 titled 'INTEGRATED CIRCUIT DEVICE
Simplified Explanation
An integrated circuit device with a unique interconnection structure that includes metal-containing particles dispersed in a metal plug.
- The device has an insulating structure above a substrate.
- The interconnection structure penetrates the insulating structure and includes a metal plug with metal-containing particles.
- The metal-containing particles are irregularly dispersed in a lower plug region of the metal plug.
Key Features and Innovation
- Insulating structure above a substrate.
- Interconnection structure with a metal plug.
- Metal-containing particles dispersed in the metal plug.
Potential Applications
This technology could be used in various electronic devices that require efficient interconnection structures, such as smartphones, computers, and other consumer electronics.
Problems Solved
This technology addresses the need for reliable and efficient interconnection structures in integrated circuit devices.
Benefits
- Improved performance of integrated circuit devices.
- Enhanced reliability of interconnection structures.
- Potential for miniaturization of electronic devices.
Commercial Applications
- Semiconductor industry for manufacturing integrated circuits.
- Electronics manufacturing for consumer products.
- Research and development in the field of microelectronics.
Prior Art
Readers can explore prior patents related to interconnection structures in integrated circuit devices to understand the evolution of this technology.
Frequently Updated Research
Researchers are constantly exploring new materials and designs for interconnection structures to improve the performance and reliability of integrated circuit devices.
Questions about Interconnection Structures
What are the key components of an interconnection structure in an integrated circuit device?
The key components include the insulating structure, the interconnection structure with a metal plug, and metal-containing particles dispersed in the metal plug.
How does the dispersion of metal-containing particles in the metal plug impact the performance of the integrated circuit device?
The irregular dispersion of metal-containing particles in the lower plug region of the metal plug can enhance the conductivity and reliability of the interconnection structure.
Original Abstract Submitted
an integrated circuit device includes an insulating structure above a substrate, and an interconnection structure penetrating the insulating structure in a first direction and including a first local protrusion portion. the first local protrusion portion protrudes outward in a second direction perpendicular to the first direction from a position adjacent to a lower surface of the insulating structure. the interconnection structure further includes a metal plug including a first metal, and a plurality of metal-containing particles including a second metal that is different from the first metal. the plurality of metal-containing particles are irregularly dispersed in a lower plug region of the metal plug, and the lower plug region is spaced apart from an upper surface of the metal plug and includes the first local protrusion portion.
