Samsung electronics co., ltd. (20240203824). SEMICONDUCTOR DEVICE WITH TWO-PHASE COOLING STRUCTURE simplified abstract
Contents
SEMICONDUCTOR DEVICE WITH TWO-PHASE COOLING STRUCTURE
Organization Name
Inventor(s)
Sungchan Kang of Suwon-si (KR)
SEMICONDUCTOR DEVICE WITH TWO-PHASE COOLING STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240203824 titled 'SEMICONDUCTOR DEVICE WITH TWO-PHASE COOLING STRUCTURE
Simplified Explanation:
This semiconductor device includes a cooling channel within the semiconductor chip to provide a path for coolant, with the addition of an ultrasonic vibrator to prevent vapor stagnation or film generation.
- The semiconductor device has a cooling channel for coolant flow.
- An ultrasonic vibrator is included in the cooling channel.
- The ultrasonic vibrator prevents vapor stagnation and film generation.
Key Features and Innovation:
- Integration of a cooling channel within the semiconductor chip.
- Inclusion of an ultrasonic vibrator to prevent vapor-related issues.
Potential Applications:
This technology could be applied in various semiconductor devices requiring efficient cooling systems.
Problems Solved:
This innovation addresses the issues of vapor stagnation and film generation within semiconductor devices.
Benefits:
- Improved cooling efficiency.
- Prevention of vapor-related problems.
Commercial Applications:
Potential commercial applications include semiconductor manufacturing, electronics cooling systems, and high-performance computing devices.
Prior Art:
Readers can explore prior research on semiconductor cooling systems and ultrasonic technologies in semiconductor devices.
Frequently Updated Research:
Stay updated on advancements in semiconductor cooling technologies and ultrasonic applications in the semiconductor industry.
Questions about Semiconductor Cooling Systems:
1. What are the key advantages of using an ultrasonic vibrator in a cooling channel? 2. How does the integration of a cooling channel within a semiconductor chip improve overall device performance?
Original Abstract Submitted
a semiconductor device includes a semiconductor chip including a semiconductor integrated circuit, and a cooling channel formed in the semiconductor chip and providing a moving path for a coolant. an ultrasonic vibrator may be arranged in the cooling channel. the ultrasonic vibrator may vibrate the coolant. by doing so, the stagnation of vapors and/or generation of a vapor film may be reduced or prevented.
