Samsung electronics co., ltd. (20240203813). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Wooseup Hwang of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240203813 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application consists of multiple semiconductor dies stacked on top of each other, with non-conductive layers in between them. Each of the second semiconductor dies is smaller in width than the first semiconductor die and includes various layers and components.
- The package includes a first semiconductor die and multiple second semiconductor dies stacked on top of each other.
- A first non-conductive layer is placed between the first semiconductor die and the lowermost second semiconductor die.
- Each second semiconductor die includes a substrate, interlayer dielectric layer, through electrodes, and passivation layer.
- A first groove is present in the passivation layer and a portion of the substrate.
- The second non-conductive layer is located within the first groove.
Potential Applications: - This technology can be used in the manufacturing of advanced semiconductor packages for various electronic devices. - It can improve the performance and reliability of semiconductor components in compact spaces.
Problems Solved: - Addresses the challenge of stacking multiple semiconductor dies in a package while maintaining proper insulation and connectivity. - Enhances the overall efficiency and functionality of semiconductor devices.
Benefits: - Improved compactness and efficiency in semiconductor packaging. - Enhanced performance and reliability of electronic devices. - Potential cost savings in manufacturing processes.
Commercial Applications: - This technology can be applied in the production of smartphones, tablets, laptops, and other consumer electronics. - It can also be utilized in automotive electronics, medical devices, and industrial equipment.
Prior Art: - Further research is recommended to explore existing patents and publications related to stacked semiconductor die packaging and non-conductive layers.
Frequently Updated Research: - Stay updated on advancements in semiconductor packaging technologies, materials science, and microelectronics manufacturing processes.
Questions about the Technology: 1. How does the presence of non-conductive layers impact the performance of the semiconductor package? 2. What are the potential challenges in scaling this technology for mass production?
Original Abstract Submitted
a semiconductor package includes a first semiconductor die, second semiconductor dies each of which has a width less than a width of the first semiconductor die and which are stacked on the first semiconductor die, a first non-conductive layer between the first semiconductor die and a lowermost second semiconductor die, and a second non-conductive layer between adjacent ones of the second semiconductor dies. each of the second semiconductor dies includes a first substrate that has a first front surface and a first rear surface, a first interlayer dielectric layer that covers the first front surface, first through electrodes that penetrate the first substrate, and a first passivation layer that covers the first rear surface. a first groove is in the first passivation layer and a portion of the first substrate. the second non-conductive layer is within the first groove.
