Samsung electronics co., ltd. (20240203796). METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract
Contents
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Byeong Seon Park of Suwon-si (KR)
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240203796 titled 'METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
The method described in the abstract involves manufacturing a semiconductor device by forming a stack on a wafer, which includes multiple layers. A photoresist pattern is then formed on the stack. The method includes determining if there have been any changes in the material of a layer or in the processes used to form the layers of the stack. If changes are detected, the wavelength for overlay measurement is adjusted accordingly, and the overlay is measured using the new wavelength.
- Method for manufacturing a semiconductor device with a stack on a wafer
- Includes multiple layers in the stack and a photoresist pattern
- Detects changes in material or processes of the stack layers
- Adjusts wavelength for overlay measurement based on detected changes
- Measures overlay using the adjusted wavelength
Potential Applications: - Semiconductor manufacturing industry - Integrated circuit production - Nanotechnology research and development
Problems Solved: - Ensures accurate measurement of overlay in semiconductor devices - Improves quality control in manufacturing processes - Enhances efficiency and reliability of semiconductor fabrication
Benefits: - Increased precision in semiconductor device manufacturing - Reduction of errors and defects in the production process - Cost savings through improved process control
Commercial Applications: Title: Advanced Semiconductor Device Manufacturing Method This technology can be utilized in the production of various semiconductor devices, such as microprocessors, memory chips, and sensors. It offers a competitive advantage to companies in the semiconductor industry by improving the accuracy and efficiency of manufacturing processes.
Prior Art: Researchers and engineers in the semiconductor field can explore prior studies on overlay measurement techniques, process control in semiconductor fabrication, and advancements in photoresist technology to further understand the innovation described in this patent application.
Frequently Updated Research: Researchers may find updated studies on semiconductor manufacturing processes, overlay measurement technologies, and advancements in nanoscale fabrication techniques relevant to this technology.
Questions about Semiconductor Device Manufacturing Method: 1. How does the method described in the patent application improve the accuracy of overlay measurement in semiconductor device manufacturing? 2. What are the potential implications of adjusting the wavelength for overlay measurement based on changes in material or processes in the stack layers?
Original Abstract Submitted
a method for manufacturing a semiconductor device, the method including forming a stack on a wafer, wherein the stack includes a plurality of layers of the stack, forming a photoresist pattern on the stack, determining whether a material of at least one layer among the plurality of layers of the stack has changed and whether at least one process among a plurality of processes for forming the plurality of layers of the stack has changed, changing a first wavelength for overlay measurement upon determination that the material of the at least one layer or the at least one process has changed, and measuring an overlay using the changed first wavelength for overlay measurement.
