Samsung electronics co., ltd. (20240203793). BACKSIDE CONTACT FORMATION USING PILLAR PATTERNING simplified abstract
Contents
- 1 BACKSIDE CONTACT FORMATION USING PILLAR PATTERNING
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 BACKSIDE CONTACT FORMATION USING PILLAR PATTERNING - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Key Features and Innovation
- 1.6 Potential Applications
- 1.7 Problems Solved
- 1.8 Benefits
- 1.9 Commercial Applications
- 1.10 Prior Art
- 1.11 Frequently Updated Research
- 1.12 Questions about Backside Contact Technologies
- 1.13 Original Abstract Submitted
BACKSIDE CONTACT FORMATION USING PILLAR PATTERNING
Organization Name
Inventor(s)
Tae Sun Kim of Ballston Spa NY (US)
Wonhyuk Hong of Clifton Park NY (US)
Jongjin Lee of Clifton Park NY (US)
Buhyun Ham of Mechanicville NY (US)
Kang-ill Seo of Springfield VA (US)
BACKSIDE CONTACT FORMATION USING PILLAR PATTERNING - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240203793 titled 'BACKSIDE CONTACT FORMATION USING PILLAR PATTERNING
Simplified Explanation
The patent application describes a backside contact to a semiconductor device with a positive slope and a dielectric sidewall liner to improve contact quality for backside power distribution networks.
Key Features and Innovation
- Backside contact with positive slope
- Dielectric sidewall liner
- Improved contact quality for backside power distribution networks
Potential Applications
This technology can be applied in the semiconductor industry for enhancing the performance of power distribution networks in various electronic devices.
Problems Solved
The technology addresses the issue of achieving higher contact quality in backside power distribution networks, which is crucial for efficient functioning of semiconductor devices.
Benefits
- Enhanced contact quality
- Improved performance of power distribution networks
- Increased efficiency of semiconductor devices
Commercial Applications
Commercial applications of this technology include semiconductor manufacturing, electronics industry, and power distribution systems for electronic devices.
Prior Art
Readers can explore prior art related to backside contact technologies in semiconductor devices to understand the evolution of similar innovations in the industry.
Frequently Updated Research
Researchers are continuously exploring new methods and materials to further improve the contact quality and efficiency of backside power distribution networks in semiconductor devices.
Questions about Backside Contact Technologies
What are the key advantages of using a backside contact with a positive slope?
A backside contact with a positive slope allows for better contact quality and improved performance in power distribution networks.
How does the dielectric sidewall liner contribute to enhancing contact quality in semiconductor devices?
The dielectric sidewall liner helps in reducing leakage and improving insulation, leading to higher contact quality in backside power distribution networks.
Original Abstract Submitted
in order to achieve higher contact quality for backside power distribution networks, provided is a backside contact to a semiconductor device having a positive slope and a dielectric sidewall liner, and methods for making the same.
