Samsung electronics co., ltd. (20240196633). MEMORY DEVICE AND SYSTEM HAVING MULTIPLE PHYSICAL INTERFACES simplified abstract

MEMORY DEVICE AND SYSTEM HAVING MULTIPLE PHYSICAL INTERFACES

Organization Name

samsung electronics co., ltd.

Inventor(s)

Yunseok Yang of Suwon-si (KR)

Seula Ryu of Suwon-si (KR)

Jaewoo Shin of Suwon-si (KR)

Minhwan An of Suwon-si (KR)

Seongjin Lee of Suwon-si (KR)

Sunghak Lee of Suwon-si (KR)

Eungchang Lee of Suwon-si (KR)

Yunkyeong Jeong of Suwon-si (KR)

Jinsuk Chung of Suwon-si (KR)

MEMORY DEVICE AND SYSTEM HAVING MULTIPLE PHYSICAL INTERFACES - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240196633 titled 'MEMORY DEVICE AND SYSTEM HAVING MULTIPLE PHYSICAL INTERFACES

Simplified Explanation

The patent application describes a memory device with multiple physical interfaces, including a buffer die and a memory die stack. The memory device can communicate with an external device through two interface circuits, activated by different selection signals from a memory controller.

• The memory device has a buffer die with two interface circuits for communication with an external device.
• A memory die stack is mounted on the buffer die, consisting of multiple stacked memory dies.
• The memory dies are electrically connected to the interface circuits, which are activated by different selection signals.
• The selection signals are received from a memory controller external to the memory device.

Key Features and Innovation

• Memory device with multiple physical interfaces.
• Buffer die with two interface circuits for communication.
• Memory die stack with stacked memory dies.
• Interface circuits activated by different selection signals.
• Memory controller provides selection signals.

Potential Applications

This technology can be used in various memory devices, data storage systems, and computing applications where efficient communication between memory devices and external controllers is required.

Problems Solved

• Efficient communication between memory devices and external controllers.
• Simplified interface activation process.
• Enhanced data transfer speeds and reliability.

Benefits

• Improved data transfer efficiency.
• Enhanced system performance.
• Simplified memory device integration.

Commercial Applications

The technology can be applied in data centers, servers, high-performance computing systems, and other devices requiring fast and reliable memory access for optimal performance.

Prior Art

Readers interested in exploring prior art related to this technology can start by researching memory device interface technologies, memory die stacking techniques, and memory controller communication protocols.

Frequently Updated Research

Stay updated on advancements in memory device interface technologies, memory die stacking methods, and memory controller integration for improved system performance.

Questions about Memory Device Interface Technology

How does the memory device interface technology improve data transfer efficiency?

The memory device interface technology enhances data transfer efficiency by allowing for faster and more reliable communication between memory devices and external controllers, resulting in improved system performance.

What are the potential applications of memory device interface technology beyond data storage systems?

Memory device interface technology can be utilized in various computing applications, data centers, and high-performance systems where efficient memory access and communication are essential for optimal performance.

Original Abstract Submitted

a memory device and a system includes a plurality of physical interfaces. the memory device includes a buffer die including a first interface circuit and a second interface circuit configured to communicate with an external device and a memory die stack mounted on the buffer die and including a plurality of stacked memory dies. the plurality of memory dies are electrically connected to the first interface circuit and the second interface circuit, the first interface circuit is configured to activate responsive to a first selection signal, and the second interface circuit is configured to activate responsive to a second selection signal. the first selection signal and the second selection signal are received from a memory controller external to the memory device.