Samsung electronics co., ltd. (20240194648). STACKED SEMICONDUCTOR PACKAGE simplified abstract
Contents
STACKED SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Seungduk Baek of Suwon-si (KR)
STACKED SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240194648 titled 'STACKED SEMICONDUCTOR PACKAGE
Simplified Explanation:
This patent application describes a semiconductor package with multiple semiconductor chips stacked vertically on a base structure, where the chip regions of the chips partially overlap. The first semiconductor chip is wider than the second semiconductor chip.
- The semiconductor package includes a base structure and multiple semiconductor chips stacked vertically.
- Each semiconductor chip has a chip region, and the chip regions overlap partially.
- The first semiconductor chip is wider than the second semiconductor chip.
- Scribe regions are present on opposite sides of each chip region.
Potential Applications: This technology could be used in various electronic devices that require compact and efficient semiconductor packaging, such as smartphones, tablets, and IoT devices.
Problems Solved: This innovation addresses the need for space-saving and high-density semiconductor packaging solutions in modern electronic devices.
Benefits: - Increased efficiency in semiconductor chip stacking - Space-saving design for compact electronic devices - Improved thermal management due to efficient chip arrangement
Commercial Applications: Title: "Compact Semiconductor Packaging for Electronic Devices" This technology could be commercially applied in the manufacturing of smartphones, tablets, wearables, and other compact electronic devices. The market implications include improved performance and design flexibility for electronic manufacturers.
Prior Art: Readers can explore prior art related to semiconductor packaging techniques, vertical stacking of semiconductor chips, and scribe region designs in semiconductor devices.
Frequently Updated Research: Stay updated on the latest advancements in semiconductor packaging technologies, vertical chip stacking methods, and innovations in compact electronic device design.
Questions about Semiconductor Packaging Technology: 1. How does the width difference between the first and second semiconductor chips impact the overall performance of the semiconductor package? 2. What are the potential challenges in implementing this compact semiconductor packaging design in mass production?
Original Abstract Submitted
a semiconductor package includes a base structure and a plurality of semiconductor chips disposed on the base structure. each of the plurality of semiconductor chips has a chip region. the plurality of semiconductor chips are stacked in a vertical direction such that chip regions at least partially overlap each other. in the stack of the plurality of semiconductor chips, each of the plurality of semiconductor chips has a first width in a first direction and a second width in a second direction. the plurality of semiconductor chips include a first semiconductor chip and a second semiconductor chip, having scribe regions on opposite sides of each of the chip regions. a first width of the first semiconductor chip is greater than a first width of the second semiconductor chip.
