Samsung electronics co., ltd. (20240194627). SEMICONDUCTOR DEVICES INCLUDING SEED STRUCTURE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICES simplified abstract
SEMICONDUCTOR DEVICES INCLUDING SEED STRUCTURE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICES
Organization Name
Inventor(s)
Seungmin Baek of Suwon-si (KR)
SEMICONDUCTOR DEVICES INCLUDING SEED STRUCTURE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240194627 titled 'SEMICONDUCTOR DEVICES INCLUDING SEED STRUCTURE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICES
Simplified Explanation:
This semiconductor device features a seed structure on a complex structure, including barrier layers and seed layers, with an electrode layer on top.
- The semiconductor device includes a seed structure with multiple layers.
- The seed structure consists of barrier layers and seed layers.
- An electrode layer is placed on the seed structure.
Key Features and Innovation:
- Seed structure with barrier and seed layers.
- Electrode layer on top of the seed structure.
Potential Applications:
This technology could be used in various semiconductor applications, such as integrated circuits, sensors, and power electronics.
Problems Solved:
This technology addresses the need for improved semiconductor device performance and efficiency.
Benefits:
- Enhanced performance of semiconductor devices.
- Increased efficiency in electronic applications.
Commercial Applications:
Potential commercial applications include the semiconductor industry, electronics manufacturing, and research and development.
Prior Art:
Readers can explore prior art related to semiconductor device structures, barrier layers, and electrode placement in semiconductor devices.
Frequently Updated Research:
Stay informed about the latest research on semiconductor device structures, materials, and manufacturing processes.
Questions about Semiconductor Devices:
1. What are the key components of a semiconductor device? 2. How does the seed structure impact the performance of a semiconductor device?
Original Abstract Submitted
a semiconductor device may include a seed structure on a complex structure. the seed structure may include a first barrier layer, a first seed layer on the first barrier layer, a second barrier layer on the first seed layer, and a second seed layer on the second barrier layer. the second barrier layer may contact a side surface of at least one of the first barrier layer and the first seed layer. an electrode layer may be disposed on the seed structure.
