Samsung electronics co., ltd. (20240194626). SEMICONDUCTOR PACKAGE simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Key Features and Innovation
- 1.6 Potential Applications
- 1.7 Problems Solved
- 1.8 Benefits
- 1.9 Commercial Applications
- 1.10 Prior Art
- 1.11 Frequently Updated Research
- 1.12 Questions about Semiconductor Package with Capacitor Integration
- 1.13 Original Abstract Submitted
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SOOJEOUNG Park of Hwaseong-si (KR)
HEI SEUNG Kim of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240194626 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the patent application includes a redistribution layer, a semiconductor chip with chip pads, a capacitor chip, an insulating layer, and conductive posts for connection.
- The semiconductor chip has chip pads exposed on its surface.
- A capacitor chip is placed between the semiconductor chip and the redistribution layer.
- The insulating layer covers the semiconductor chip and the capacitor chip.
- Conductive posts connect the chip pads to the redistribution layer.
Key Features and Innovation
- Integration of a capacitor chip within the semiconductor package.
- Use of conductive posts for connecting the chip pads to the redistribution layer.
- Insulating layer for protection and isolation of components.
Potential Applications
This technology can be used in various semiconductor devices requiring capacitors for energy storage and signal filtering.
Problems Solved
- Efficient integration of capacitors in semiconductor packages.
- Improved connectivity and reliability of semiconductor components.
Benefits
- Enhanced performance and functionality of semiconductor devices.
- Space-saving design with integrated components.
Commercial Applications
- This technology can be applied in the manufacturing of advanced electronic devices such as smartphones, tablets, and computers, improving their performance and reliability.
Prior Art
Prior art related to this technology may include patents or publications on semiconductor packaging techniques involving capacitors and conductive interconnects.
Frequently Updated Research
Research on advanced semiconductor packaging techniques and materials may provide insights into further optimizing the design and performance of such devices.
Questions about Semiconductor Package with Capacitor Integration
What are the advantages of integrating a capacitor within a semiconductor package?
Integrating a capacitor within a semiconductor package allows for more compact designs, improved signal filtering, and enhanced energy storage capabilities.
How do conductive posts contribute to the connectivity of the semiconductor package?
Conductive posts provide a reliable connection between the chip pads and the redistribution layer, ensuring efficient signal transmission and power distribution within the device.
Original Abstract Submitted
a semiconductor package includes a redistribution layer and a semiconductor chip provided on the redistribution layer having a first surface and a second surface opposite to the first surface. the semiconductor chip includes a first chip pad and a second chip pad which are exposed at the first surface. the semiconductor package further includes a capacitor chip disposed between the first surface and the redistribution layer and including a capacitor chip pad connected to the first chip pad, an insulating layer covering the first surface and the capacitor chip, and a conductive post being in contact with the second chip pad and penetrating the insulating layer so as to be connected to the redistribution layer. the conductive post may be spaced apart from the capacitor chip.
