Samsung electronics co., ltd. (20240194624). SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract
Contents
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Organization Name
Inventor(s)
Hyeonjeong Kim of Suwon-si (KR)
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240194624 titled 'SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
The semiconductor chip described in the patent application includes a semiconductor substrate with an active surface and an inactive surface, a multi-wiring layer on the active surface, a lower protection layer with a conductive medium pad, through vias penetrating the substrate, and back side pads on the inactive surface connected to the through vias.
- The semiconductor chip features a multi-wiring layer with at least two layers, including a conductive wiring and a dummy wiring.
- The lower protection layer includes a conductive medium pad connected to the conductive wiring.
- The through vias consist of power through vias, signal through vias, and dummy through vias.
- The back side pads on the inactive surface are connected to the through vias, including the dummy through vias.
Potential Applications: - This technology can be used in the manufacturing of advanced semiconductor chips for various electronic devices. - It can improve the performance and reliability of integrated circuits in applications such as smartphones, computers, and automotive electronics.
Problems Solved: - Enhances the connectivity and signal transmission efficiency within semiconductor chips. - Provides protection and stability to the wiring structures on the chip.
Benefits: - Improved functionality and performance of electronic devices. - Enhanced durability and longevity of semiconductor chips. - Increased efficiency in signal transmission and data processing.
Commercial Applications: - The technology can be utilized by semiconductor manufacturers to produce high-quality chips for consumer electronics, industrial equipment, and communication devices.
Questions about Semiconductor Chip Technology: 1. How does the multi-wiring layer contribute to the overall performance of the semiconductor chip? 2. What are the specific advantages of using dummy through vias in the chip design?
Frequently Updated Research: - Stay updated on the latest advancements in semiconductor chip technology to incorporate cutting-edge features and improvements in future designs.
Original Abstract Submitted
a semiconductor chip includes a semiconductor substrate including an active surface and an inactive surface facing the active surface, a multi wiring layer arranged on the active surface of the semiconductor substrate, and including a wiring structure having at least two layers and including a conductive wiring and a dummy wiring, a lower protection layer arranged on a front surface of the multi wiring layer, and including a conductive medium pad connected to the conductive wiring, a plurality of through vias configured to penetrate the semiconductor substrate, and including a plurality of power through vias, a plurality of signal through vias, and a plurality of dummy through vias; and a plurality of back side pads arranged on the inactive surface of the semiconductor substrate, and connected to the plurality of through vias, wherein the plurality of dummy through vias are connected to the wiring structure.
