Samsung electronics co., ltd. (20240194577). SEMICONDUCTOR DEVICE simplified abstract
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Yoonyoung Jeon of Suwon-si (KR)
Woongkeon Lee of Suwon-si (KR)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240194577 titled 'SEMICONDUCTOR DEVICE
The semiconductor package described in the patent application consists of a complex structure involving multiple layers and materials to enhance the performance and reliability of the package.
- The package includes a redistribution structure with alternating layers of redistribution and insulating materials, providing a robust foundation for the semiconductor chip.
- The semiconductor chip is electrically connected to the redistribution structure, ensuring efficient communication and data transfer within the package.
- A pad, also electrically connected to the redistribution structure, is overlapped by a pad surface layer made of a different conductive material, enhancing connectivity and conductivity.
- The pad features an anchor portion protruding from its surface, further improving the structural integrity and electrical performance of the package.
Potential Applications: - This technology can be utilized in various electronic devices requiring high-performance semiconductor packages, such as smartphones, tablets, and computers. - It can also be beneficial in industrial applications where reliable and efficient semiconductor packaging is crucial for the operation of complex systems.
Problems Solved: - The technology addresses the need for advanced semiconductor packaging solutions that offer improved performance, reliability, and connectivity. - It solves the challenges associated with ensuring proper electrical connections and structural integrity in semiconductor packages.
Benefits: - Enhanced performance and reliability of semiconductor packages. - Improved connectivity and data transfer efficiency. - Increased structural integrity and durability of electronic devices.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Performance This technology has significant commercial potential in the consumer electronics industry, particularly in the development of high-performance devices with advanced semiconductor packages. The market implications include improved product quality, reliability, and customer satisfaction.
Prior Art: Further research can be conducted in the field of semiconductor packaging technologies to explore existing patents and innovations related to complex package structures and materials.
Frequently Updated Research: Researchers are continuously exploring new materials and techniques to enhance semiconductor packaging performance and reliability. Stay updated on the latest advancements in the field to leverage cutting-edge technologies for future developments.
Questions about Semiconductor Package Technology: 1. How does the use of different conductive materials in the pad surface layer improve the performance of the semiconductor package? 2. What are the potential challenges in integrating the anchor portion into the pad design, and how are they addressed in this technology?
Original Abstract Submitted
a semiconductor package includes a first redistribution structure having at least one first redistribution layer and at least one first insulating layer that are alternately stacked, a semiconductor chip electrically connected to the first redistribution structure, a second insulating layer disposed above the semiconductor chip and having an opening, a pad electrically connected to the first redistribution structure, disposed on the second insulating layer, and overlapping the opening, a pad surface layer disposed on a first region of an upper surface of the pad to overlap the opening, the pad surface layer formed of a first conductive material different from a second conductive material forming the pad. the pad has an anchor portion protruding from a second region of the upper surface of the pad. the anchor portion protrudes to a position higher than that of a lower surface of the pad surface layer.
