Samsung electronics co., ltd. (20240194499). APPARATUS FOR CLEANING PROCESS AND METHOD FOR CLEANING PROCESS simplified abstract
Contents
- 1 APPARATUS FOR CLEANING PROCESS AND METHOD FOR CLEANING PROCESS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 APPARATUS FOR CLEANING PROCESS AND METHOD FOR CLEANING PROCESS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Key Features and Innovation
- 1.6 Potential Applications
- 1.7 Problems Solved
- 1.8 Benefits
- 1.9 Commercial Applications
- 1.10 Prior Art
- 1.11 Frequently Updated Research
- 1.12 Questions about Substrate Cleaning
- 1.13 Original Abstract Submitted
APPARATUS FOR CLEANING PROCESS AND METHOD FOR CLEANING PROCESS
Organization Name
Inventor(s)
Chaelyoung Kim of Suwon-si (KR)
APPARATUS FOR CLEANING PROCESS AND METHOD FOR CLEANING PROCESS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240194499 titled 'APPARATUS FOR CLEANING PROCESS AND METHOD FOR CLEANING PROCESS
Simplified Explanation
The patent application describes a method for cleaning a substrate by forming a polymer layer containing particles adsorbed from the surface of the layer and then removing the polymer layer.
- A substrate is loaded onto a substrate stage.
- A photocurable resin is spin coated on the layer to form a photocurable resin layer.
- Light is irradiated onto the photocurable resin layer to cure it and form a polymer layer containing particles.
- The polymer layer containing particles is then removed.
Key Features and Innovation
- Utilizes a photocurable resin layer to form a polymer layer containing particles.
- Removes particles from the surface of the layer for cleaning purposes.
Potential Applications
The technology can be used in the semiconductor industry for cleaning substrates and removing particles from surfaces.
Problems Solved
Addresses the issue of cleaning substrates and removing particles effectively.
Benefits
- Efficient cleaning process for substrates.
- Removes particles from surfaces to improve overall cleanliness.
Commercial Applications
The technology can be applied in semiconductor manufacturing processes to ensure clean and particle-free substrates, leading to higher quality products.
Prior Art
Readers can explore prior art related to cleaning processes in the semiconductor industry to understand the evolution of substrate cleaning technologies.
Frequently Updated Research
Stay updated on research related to substrate cleaning methods and advancements in material science for cleaning processes.
Questions about Substrate Cleaning
What are the key advantages of using a photocurable resin layer in the cleaning process?
The use of a photocurable resin layer allows for precise control over the formation of the polymer layer containing particles, ensuring effective cleaning.
How does the technology compare to traditional substrate cleaning methods?
The technology offers a more targeted approach to removing particles from surfaces compared to traditional cleaning methods, potentially leading to improved cleanliness and product quality.
Original Abstract Submitted
in a method for cleaning process, a substrate on which a layer is formed may be loaded on a substrate stage. a photocurable resin may be spin coated on the layer to form a photocurable resin layer. light may be irradiated onto the photocurable resin layer for curing the photocurable resin layer to form a polymer layer containing particles adsorbed from a surface of the layer. the polymer layer containing the particles may be removed.
