Samsung electronics co., ltd. (20240192712). TEMPERATURE CONTROL SYSTEM AND TEMPERATURE CONTROL METHOD FOR SEMICONDUCTOR MANUFACTURING DEVICE simplified abstract

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TEMPERATURE CONTROL SYSTEM AND TEMPERATURE CONTROL METHOD FOR SEMICONDUCTOR MANUFACTURING DEVICE

Organization Name

samsung electronics co., ltd.

Inventor(s)

HYEONJUN Yun of SUWON-SI (KR)

SANGSU Yeh of SUWON-SI (KR)

MINSU Lee of SUWON-SI (KR)

JONGHWA Kim of SUWON-SI (KR)

JOOYEOP Nam of SUWON-SI (KR)

TEMPERATURE CONTROL SYSTEM AND TEMPERATURE CONTROL METHOD FOR SEMICONDUCTOR MANUFACTURING DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240192712 titled 'TEMPERATURE CONTROL SYSTEM AND TEMPERATURE CONTROL METHOD FOR SEMICONDUCTOR MANUFACTURING DEVICE

Simplified Explanation

The patent application describes a temperature control system for a semiconductor manufacturing device that utilizes a mixing device to combine low-temperature and high-temperature heating media at a specific ratio. The control device manages the mixing ratio based on the temperature of the heating media passing through the load, ensuring it reaches a target temperature.

  • The system includes first and second heating media storages for low and high-temperature heating media.
  • A mixing device with a mixing valve blends the heating media at a predetermined ratio.
  • The control device regulates the mixing ratio based on the temperature of the heating media passing through the load.
  • Recovered heating media is distributed back to the storages for reuse.

Key Features and Innovation

  • Utilization of a mixing device to combine low and high-temperature heating media.
  • Control device adjusts the mixing ratio based on the temperature of the heating media passing through the load.
  • Efficient recovery and distribution of heating media for reuse.

Potential Applications

The technology can be applied in various semiconductor manufacturing processes where precise temperature control is crucial.

Problems Solved

  • Ensures consistent and accurate temperature control in semiconductor manufacturing.
  • Efficient use of heating media by recovering and redistributing it.

Benefits

  • Improved temperature control accuracy.
  • Energy-efficient operation through heating media recovery.
  • Enhanced process reliability in semiconductor manufacturing.

Commercial Applications

Title: Advanced Temperature Control System for Semiconductor Manufacturing The technology can be utilized in semiconductor fabrication facilities to enhance production efficiency and product quality. It can also be integrated into other industrial processes requiring precise temperature control.

Prior Art

Readers can explore prior patents related to temperature control systems in semiconductor manufacturing to understand the evolution of such technologies.

Frequently Updated Research

Stay updated on the latest advancements in temperature control systems for semiconductor manufacturing to incorporate cutting-edge features and improvements into the technology.

Questions about Temperature Control Systems

How does the mixing device contribute to temperature control efficiency?

The mixing device combines low and high-temperature heating media to achieve the desired temperature, enhancing control accuracy and efficiency.

What role does the control device play in regulating the mixing ratio?

The control device adjusts the mixing ratio based on the temperature of the heating media passing through the load, ensuring precise temperature control.


Original Abstract Submitted

a temperature control system of a semiconductor manufacturing device includes first and second heating media storages that respectively store low-temperature heating media and high-temperature heating media, a mixing device including a mixing valve that mixes the low-temperature heating media and the high-temperature heating media at a predetermined mixing ratio, and a control device. the mixing device provides mixed heating media to a load, and distributes recovered heating media recovered from the load to the first and second heating media storages. the control device is configured to, by performing feed-forward control and feedback control over a mixing unit temperature using a relationship model between a reference temperature representing a temperature of heating media passing through the load and the mixing unit temperature which is a temperature of heating media output by the mixing valve, control the mixing ratio such that the reference temperature has a target reference temperature.